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HyperX Savage 8GB (2 X 4GB) Memory Kit 1600MHz DDR3 CL9 DIMM
HyperX HX316C9SRK28 is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8 memory module based on eight 512M x 8-bit FBGA components per module Each module kit supports Intel XMP (Extreme Memory Profiles) Total kit capacity is 8GB Each module has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 15V The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 15V Each 240-pin DIMM uses gold contact fingers JEDEC standard 15V (1425V 1575V) Power Supply VDDQ 15V (1425V 1575V) 800MHz fCK for 1600Mbsecpin 8 independent internal banks Programmable CAS latency 11 10 9 8 7 6 Programmable Additive Latency 0 CL - 2 or CL - 1 clock 8-bit pre-fetch Burst Length 8 (interleave without any limit sequential with starting address &000& only)
4 with tCCD 4 which does not allow seamless read or write (either on the fly using A12 or MRS) Bi-directional Differential Data Strobe Internal (self) calibration Internal self calibration through ZQ pin (RZQ 240 ohm ± 1) On Die Termination using ODT pin Average Refresh Period 78us at lower than TCASE 85°C 39us at 85°C < TCASE < 95°C degrees Asynchronous Reset PCB Height 1180 inch (3000mm) single sided component Memory Memory Size 8192 MB (2 module(s) x 4096 MB ) Memory Type DDR3 Memory Speed 1600 MHz Memory Package DIMM Pin Configuration 240 pins CAS Latency CL9 Module Configuration 512M x 64 Electrical Voltage 15 V Environmental Operating Temperature 0 to 85 °C Non Operating Temperature -55 to 100 °C Physical Form Factor Memory Kit Case Colour Red
Dimensions 133 cm (W) x 32 cm (D)
4 with tCCD 4 which does not allow seamless read or write (either on the fly using A12 or MRS) Bi-directional Differential Data Strobe Internal (self) calibration Internal self calibration through ZQ pin (RZQ 240 ohm ± 1) On Die Termination using ODT pin Average Refresh Period 78us at lower than TCASE 85°C 39us at 85°C < TCASE < 95°C degrees Asynchronous Reset PCB Height 1180 inch (3000mm) single sided component Memory Memory Size 8192 MB (2 module(s) x 4096 MB ) Memory Type DDR3 Memory Speed 1600 MHz Memory Package DIMM Pin Configuration 240 pins CAS Latency CL9 Module Configuration 512M x 64 Electrical Voltage 15 V Environmental Operating Temperature 0 to 85 °C Non Operating Temperature -55 to 100 °C Physical Form Factor Memory Kit Case Colour Red
Dimensions 133 cm (W) x 32 cm (D)
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