Hyper X HX324C11SR/4 is a 512M x 64-bit (4GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module supports Intel® XMP (Extreme Memory Profiles). Each module has been tested to run at DDR3-2400 at a low latency timing of 11-13-14 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. Key Features
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 800 M Hz f CK for 1600 Mb/sec/pin
- 8 independent internal banks
- Programmable CAS latency: 11, 10, 9, 8, 7, 6
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- 8-bit pre-fetch
- Burst Length: 8 (interleave without any limit, sequential with starting address â000â only), 4 with t CCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS)
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C
- Asynchronous Reset
Specification
- CL (IDD): 11 Cycles
- Row Cycle Time (t R Cmin): 48.125ns (min.)
- Maximum Operating Power: TBD W*
- UL Rating: 94 V
- 0
- Operating Temperature: 0C to +85C
- Storage Temperature: -55C to +100C