. .. FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module has been tested to run at DDR3-1866 at a low latency timing of 9-10-11 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. Features JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 800 M Hz f CK for 1600 Mb/sec/pin 8 independent internal banks Programmable CAS Latency: 11, 10, 9, 8, 7, 6 Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address '000' only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C TCASE 95°C Asynchronous Reset PCB: Height 1.18 inch (30mm), double sided component Extra Info Memory
Size: 32768MB Module
Size: 8192MB Memory Type: DDR3 Memory Package: DIMM Pin Configuration: 240 pins Main
Colour: Red