Brand Kingston Item Weight 9 g Product

Dimensions 9.5 x 4.6 x 0.8 cm Item model number KHX16S9P1/4 RAM Size 4096 MB

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Hyper X Genesis sets the standard in high-performance memory. Like all Hyper X products, Genesis modules are specifically engineered & designed to meet the rigorous requirements of PC enthusiasts. Genesis offers greater thermal performance, higher frequency speed & lower latency. It′s available in DDR3 in single, dual, triple & quad channel memory kits. It offers impressive speeds up to 2400 M Hz & capacities up to 64GB. Hyper X Genesis is backed by a lifetime warranty & free technical support. ...

Hyper X HX424C15FB/4 is a 512M x 64-bit (4GB) DDR4-2400 CL15 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (Pn P) Timing Parameters section below. The JEDEC standard electrical & mechanical specifications are as follows: EDEC/ Pn P: DDR4-2400 CL15-15-15 @1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 46.75ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 29.125ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heatsink


























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Hyper X HX426C15FB/4 is a 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 45ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 26.25ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heatsink


























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Hyper X 64GB (8x 8GB) 2800 M Hz DDR4 CL14 DIMM Memory Hyper X HX428C14SBK8/64 is a kit of eight 1G x 64-bit (8GB) DDR4-2800 CL14 SDRAM (Synchronous DRAM) 2 Rx 8, memory modules, based on sixteen 512M x 8-bit FBGA components per module. Total kit capacity is 64GB. Each module supports Intel XMP (Extreme Memory Profiles). Each module has been tested to run at DDR4-2800 at a low latency timing of 14-15-15 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2133 timing of 15-15-15 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The JEDEC standard electrical & mechanical specifications are as follows: XMP TIMING PARAMETERS JEDEC: DDR4-2133 CL15-15-15 @1.2V XMP Profile 1: DDR4-2800 CL14-15-15 @1.35V XMP Profile 2: DDR4-2666 CL14-14-14 @1.35V SPECIFICATIONS CL (IDD) 15 cycles Row Cycle Time (t R Cmin) 46.5ns (min.) Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.) Row Active Time (t RASmin) 33ns (min.) Maximum Operating Power TBD W* UL Rating 94 V
- 0 Operating Temperature 0oC to +85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES Power Supply: VDD = 1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD = 2.25V to 3.6V On-Die termination (ODT) 16 internal banks; 4 groups of 4 banks each Bi-Directional Differential Data Strobe 8 bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.36” (34.57mm)

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Hyper X HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles Intel XMP) 2.0. Total kit capacity is 8GB. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 45ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 26.25ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heatsink


























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Hyper X Beast is part of the premiere memory line offered from Hyper X memory. It's heat spreader design & PCB colour adds boldness to any gamer, PC enthusiast or content creator's system. With high-performance hardware & innovative designs, Hyper X Beast shatters expectations. Hyper X Beast memory features a dynamic & vicious heat spreader that maximises thermal dissipation for increased reliability & a matching black PCB for a cool, aggressive look that enhances any enthusiasts' system. ...

Hyper X Beast is part of the premiere memory line offered from Hyper X memory. It's heat spreader design & PCB colour adds boldness to any gamer, PC enthusiast or content creator's system. With high-performance hardware & innovative designs, Hyper X Beast shatters expectations. Hyper X Beast memory features a dynamic & vicious heat spreader that maximises thermal dissipation for increased reliability & a matching black PCB for a cool, aggressive look that enhances any enthusiasts' system. This high-performance memory boasts large corresponding capacities from 8GB-64GB & speeds of up to 2400 M Hz for ultra-responsive multitasking & an overall fast system. This vicious Beast is designed to work with third-generation Intel Core i 5 & i 7 processors & AMD performance & gaming processors. It's available in dual & quad channel kits. ...

Hyper X HX424C15FB/8 is a 1G x 64-bit (8GB) DDR4-2400 CL15 SDRAM (Synchronous DRAM) 2 Rx 8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 46.75ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 29.125ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heat sink


























...

Hyper X HX426C15FB/8 is a 1G x 64-bit (8GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 2 Rx 8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 45ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 26.25ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Dual-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heatsink


























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