MX-2 is a high thermal conductivity & low thermal resistance compound for components that require optimum thermal dissipation. It is ideally suited for use in CPU, GPU cooling & other applications between power semiconductor components & heat sinks where thermal conductivity is a major factor. Since the MX-2 does not contain any metal particles, there are no problems regarding electrical conductivity or capacitance. Unlike other silver & copper compounds, MX-2 ensures that contact to electrical traces, pins & leads cannot result in any damage. With MX-2 no curing & no bleeding of the compound are possible. In contrast to other products, this compound does not show decreasing performance over time, does not need to be reapplied & has a durability of at least 8 years. Viscosity (poise) 850 Density (g/cm&sup 3;) 3.96 UPC 1.5g: 0872767004832 4g: 0872767002081 8g: 0872767003774 30g: 0872767002227 65g: 0872767003170
Dimensions (Packaging) 4g: 160 L x 110 W x 20 H mm Net Weight 30g itemnumber ORACO-MX20001-BL UPC Gross Weight 0.13kg