United Kingdom
France
Germany
Netherlands
Sweden
USA
Italy
Spain
More From Contributor
Asus P8H61-M LX R2.0 S1155 Intel H61 DDR3 MATX
**P8H61-M LX R2.0** - DIGI+ VRM Digital Power Design - Network iControl - Real-time Network Bandwidth Control - EPU - Energy Efficiency All Around - UEFI BIOS - EZ Mode - Flexible & Easy BIOS Interface - AI Suite II - One-stop Access to Innovative ASUS Features The Intel H61(B3) Express Chipset is the latest single-chipset design to support the 1155 socket Intel Core i7/Core i5/Core i3 2nd generation processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. **LGA1155 socket for Intel 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium / Celeron Processors** This motherboard supports the Intel 3rd/2nd generation Core™ i7/i5/i3/Pentium/Celeron processors in the LGA1155 package, with
iGPU, memory, and PCI Express controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics performance. Intel 3rd/2nd generation Core™ i7/i5/i3/Pentium/Celeron processors are among the most powerful and energy efficient CPUs in the world. **Intel H61 Express Chipset** The Intel H61 Express Chipset is a single-chipset design to support the new 1155 socket Intel 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium / Celeron processors. It provides improved performance by utilizing serial point-to-point links, which allows increased bandwidth and stability. **PCIe 3.0 Ready** PCI Express 3.0 (PCIe 3.0) is the latest PCI Express bus standard
with improved encoding schemes that provide twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must
iGPU, memory, and PCI Express controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics performance. Intel 3rd/2nd generation Core™ i7/i5/i3/Pentium/Celeron processors are among the most powerful and energy efficient CPUs in the world. **Intel H61 Express Chipset** The Intel H61 Express Chipset is a single-chipset design to support the new 1155 socket Intel 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium / Celeron processors. It provides improved performance by utilizing serial point-to-point links, which allows increased bandwidth and stability. **PCIe 3.0 Ready** PCI Express 3.0 (PCIe 3.0) is the latest PCI Express bus standard
with improved encoding schemes that provide twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must
Product Description
Reviews/Comments
Add New
Vouchers
No voucher codes found.
Do you know a voucher code for this product or supplier? Add it to Insights for others to use.
Do you know a voucher code for this product or supplier? Add it to Insights for others to use.
Denmark