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The P8H61-M LE delivers users fantastic graphics performance in an Intel LGA1155 package with memory & PCI Express controllers integrated to support 2-channel DDR3 memory & 16x PCI Express 2.0 lanes. DDR3 supports data transfer rates of 1333 / 1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia & Internet applications. The Intel H61 (B3) Express Chipset is the latest single-chipset design to support the new 1155 socket Intel Core™ i 7 / i 5 / i 3 2nd generation processors. It provides enhanced performance by utilising serial point-to-point links, allowing increased bandwidth & stability. The P8H61-M LE features a multitude of exclusive ASUS features. ASUS EFI BIOS (EZ Mode) provides a user friendly interface that goes beyond traditional keyboard BIOS input to enable more flexible & convenient mouse controls. The exclusive EZ mode displays frequently accessed setup info, whilst Advanced Mode caters for experienced performance enthusiasts. ASUS EPU (Energy Processing Unit) provides total system power management by intelligently moderating power usage in real time saving power & money. ASUS AI Suite II, this all-in-one software offers diverse & ease to use functions, with no need to switch back & forth between different utilities. AI Suite II allows users to supervise overclocking, energy management, fan speed control, voltage & sensor readings. Anti-Surge protection detects over voltage conditions to prevent voltage surges from spreading in real time. ASUS Turbo V provides the adrenaline rush of real time OC without exiting or rebooting the OS. The ASUS OC profiles in Turbo V provide the best OC settings in different scenarios. GPU Boost overclocks the integrated GPU in real time for the best graphics performance with a user friendly UI that facilitates flexible frequency & voltage adjustments. **ASUS Unique Selling Points**
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The motherboard supports DDR3 memory that features data transfer rates of 1333/1066 MHz to meet the higher bandwidth requirements of the 3D graphics, multimedia, & Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance. This motherboard uses all high-quality conductive polymer capacitors for durability, enhanced lifespan, & enhanced thermal capacity. ...
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Asus P8H61-M LE R2.0 S1155 Intel H61 DDR3 MATX

**P8H61-M LE R2.0: Precise digital power design and enhanced integrated graphics on micro ATX H61** - DIGI+ VRM - Digital power Design for the CPU and iGPU - GPU Boost - Go to the Limit with iGPU Level Up! - Network iControl - Real-time Network Bandwidth Control - LucidLogix Virtu Universal MVP™ - AI Suite II - One-stop Access to Innovative ASUS Features - Anti-Surge - Full-time Power Guardian-Make System Free From Risk This motherboard supports the Intel second generation Core i7 / Core i5 / Core i3 processors in LGA1155 package with memory. This provides great graphics performance. Intel second generation Core i7 / Core i5 / Core i3 processors are among the most powerful and energy efficient CPUs in the world. **LGA1155 socket for Intel 3rd/2nd Generation Core™ i7/
Core™ i5/ Core™ i3/ Pentium/ Celeron Processors** This motherboard supports the Intel 3rd/2nd generation Core™ i7/i5/i3/Pentium/Celeron processors in the LGA1155 package, with iGPU, memory, and PCI Express controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics performance. Intel 3rd/2nd generation Core™ i7/i5/i3/Pentium/Celeron processors are among the most powerful and energy efficient CPUs in the world. **Intel H61 Express Chipset** The Intel H61 Express Chipset is a single-chipset design to support the new 1155 socket Intel 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium / Celeron processors. It provides
improved performance by utilizing serial point-to-point links, which allows increased bandwidth and stability. **PCIe 3.0 Ready** PCI Express 3.0 (PCIe 3.0) is the latest PCI Express bus standard with improved encoding schemes that provide twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0 provides users
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Availability: In Stock
£38.92

Product Description

**P8H61-M LE R2.0: Precise digital power design & enhanced integrated graphics on micro ATX H61**
- DIGI+ VRM
- Digital power Design for the CPU & i GPU
- GPU Boost
- Go to the Limit with i GPU Level Up!
- Network i Control
- Real-time Network Bandwidth Control
- Lucid Logix Virtu Universal MVP™
- AI Suite II
- One-stop Access to Innovative ASUS Features
- Anti-Surge
- Full-time Power Guardian-Make System Free From Risk This motherboard supports the Intel second generation Core i 7 / Core i 5 / Core i 3 processors in LGA1155 package with memory. This provides great graphics performance. Intel second generation Core i 7 / Core i 5 / Core i 3 processors are among the most powerful & energy efficient CPUs in the world. **LGA1155 socket for Intel 3rd/2nd Generation Core™ i 7/ Core™ i 5/ Core™ i 3/ Pentium/ Celeron Processors** This motherboard supports the Intel 3rd/2nd generation Core™ i 7/i 5/i 3/ Pentium/ Celeron processors in the LGA1155 package, with i GPU, memory, & PCI Express controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel (2 DIMMs) DDR3 memory, & 16 PCI Express 3.0/2.0 lanes. This provides great graphics performance. Intel 3rd/2nd generation Core™ i 7/i 5/i 3/ Pentium/ Celeron processors are among the most powerful & energy efficient CPUs in the world. ** Intel H61 Express Chipset** The Intel H61 Express Chipset is a single-chipset design to support the new 1155 socket Intel 3rd/2nd Generation Core™ i 7 / Core™ i 5 / Core™ i 3 / Pentium / Celeron processors. It provides enhanced performance by utilizing serial point-to-point links, which allows increased bandwidth & stability. **PCIe 3.0 Ready** PCI Express 3.0 (PCIe 3.0) is the latest PCI Express bus standard with enhanced encoding schemes that provide twice the performance of current PCIe 2.0. Total bandwidth for a x 16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x 16 mode). As such, PCIe 3.0 provides users

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Jargon Buster

PCI - Peripheral Component Interconnect - Used as an expansion interface in computers
CPU - Central processing unit. The processing centre of computer programs. The faster the processor usually the faster the computer
Digital - A system that uses only 0s and 1s to transmit data
Energy Efficient - A term used to describe an electrical item which makes the good use of energy
Graphics - A general term for visual aspects of an item/display
AI - Artificial Intelligence - the perceived intelligence of a computer
World - A physical grouping, commonly used to describe earth and everything associated with ti
Intel - World leaders in silicon chip development and manufacture. Chips for Laptops, desktops and mobile devices. Their main competitor is AMD (Advanced Micro Devices)
Network - A link and communication between things. Often computers or people.
Precise - A measurement on the accuracy of something
Innovative - An idea that shows new method and ways of thinking, an original design.
Design - A drawing or styles that shows the look and functionality of something before its made.
Performance - When someone is presenting a form of entertainment, also how well someone is doing within a role.
Memory - A way to describe the way in which the brain can remember things.

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