Provide optimal heat transfer between CPU & heatsink through a metal oxide compound
- Metal-based compound containing metal oxide
- Thermal conductivity of more than 193 Wm-K
- Negligible electrical conductivity
- Stable performance over a wide temperature range
- 4-6 applications per tube
- Resealable syringe applicator Applications
- High demand applications such as overclocking & high performance CPUs
- Replace old or dried out thermal paste Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance & greater system stability; & is more effective than standard silicon-based heat grease CPU paste providing optimum protection against CPU heat damage The Star Techcom Advantage
- Better thermal conductivity over standard silicon-based compounds & negligible electrical conductivity for effective & safe use in high performance applications Warranty Information Warranty 2 Years Performance Bleed 193 Wm-K at 25 Thermal Resistance