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Kingston HyperX Impact 4GB (1x4GB) Memory Module 1600MHz DDR3L CL9
SODIMM Non-ECC Unbuffered 1.35V
HyperX HX316LS9IB4 is a 512M x 64-bit (4GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 1Rx8 low voltage memory module based on eight 512M x 8-bit DDR3 FBGA components This module has been tested to run at DDR3L-1600 at a low latency timing of 9-9-9 at 135V or 15V JEDEC standard 135V (128V 145V) and 15V (1425V 1575V) Power Supply VDDQ 135V (128V 145V) and 15V (1425V 1575V) 800MHz fCK for 1600Mbsecpin 8 independent internal bank Programmable CAS Latency 11 10 9 8 7 6 Programmable Additive Latency 0 CL - 2 or CL - 1 clock 8-bit pre-fetch Burst Length 8 (Interleave without any limit sequential with starting address &000& only) 4 with tCCD 4 which does not allow seamless read or write either on the fly using A12 or MRS Bi-directional Differential Data Strobe Internal(self) calibration Internal
self calibration through ZQ pin (RZQ 240 ohm ± 1) On Die Termination using ODT pin Average Refresh Period 78us at lower than TCASE 85°C 39us at 85°C < TCASE < 95°C Asynchronous Reset PCB Height 1180 inch (3000mm) double sided component Memory Memory Size 4096 MB (1 module(s) x 4096 MB ) Memory Type DDR3L Memory Speed 1600 MHz Memory Package SO-DIMM Pin Configuration 204 pins Bus IO Configuration Unbuffered Error Correction Non ECC CAS Latency CL9 Electrical Voltage 135 V Environmental Operating Temperature 0 to 85 °C Non Operating Temperature -55 to 100 °C Physical Form Factor Memory Module Case Colour Black
self calibration through ZQ pin (RZQ 240 ohm ± 1) On Die Termination using ODT pin Average Refresh Period 78us at lower than TCASE 85°C 39us at 85°C < TCASE < 95°C Asynchronous Reset PCB Height 1180 inch (3000mm) double sided component Memory Memory Size 4096 MB (1 module(s) x 4096 MB ) Memory Type DDR3L Memory Speed 1600 MHz Memory Package SO-DIMM Pin Configuration 204 pins Bus IO Configuration Unbuffered Error Correction Non ECC CAS Latency CL9 Electrical Voltage 135 V Environmental Operating Temperature 0 to 85 °C Non Operating Temperature -55 to 100 °C Physical Form Factor Memory Module Case Colour Black
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