Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials heavily filled with heat conductive metal oxides This combination promotes high thermal conductivity low bleed & high-temperature stability
- Suitable for CPU chipsets on Mainboard VGA card etc
- Easy to use
- Zif Socket Templates ensure correct applying area with various CPU socket types
- Produces an even layer when using applicator
- Dielectric
- Wide range of application temperature These compounds resist changes in consistency at temperatures up to 177 (350 maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis thereby increasing the overall efficiency of the device Colour White Volume 2g Specific Gravity 237 Viscosity Flowability Non-Flowing Shelf Life 24 months from DOM Thermal Conductivity 08 wattsmeter-C Volume Resistivity 50 x 1015 Dielectric Constant 44 at 100k Hz Dissipation Factor 002 at 100k Hz Dielectric Strength 550 voltsmil; 217 k Vmm