Bergquist GP3000S30-0.040-02-0404 Gap Pad 4 X 4 X 0.04" Sheet

Product Description

Gap Pad 3000S30 Thermally Conductive Soft Gap-filling Material
- Bergquist GP3000S30-0.040-02-0404, This 0.04in thick Gap Pad 3000S30 soft gap-filling material from Bergquist Features high thermal performance & electrical isolation at a low mounting pressure. Having inherent tackiness on both sides of the material, as well as fibreglass carrier reinforcement, enhances material handling, puncture, shear & tear resistance. This material has been designed for high performance, low-stress applications as a replacement for standoff or clip-mounting thermal devices. Having a soft & conformable yet elastic nature ensures that, with its excellent wet-out & interfacing characteristics, an efficient thermal interface is achieved. Suitable applications for this material include: processors, server S-RAMs, mass storage devices, BGA packages, notebook computers, power conversion, wireless communications hardware. Bergquist GP3000S30-0.040-02-0404 Gap Pad 4 x 4 x 0.04" Sheet