Bergquist Bond-Ply 100 Thermally Conductive Adhesive Material
- Bergquist BP100-0.005-00-0101, Bond-Ply 100 is a thermally conductive & electrically isolating, pressure sensitive adhesive material that facilitates the decoupling of materials with mismatched thermal coefficients of expansion. The double-sided adhesive coating with its high bond strength that immediately bonds to the target surface, together with excellent wet-out & high thermal performance, make this material ideally suited for use as a replacement for heat-cure adhesive & screw- or clip-mounting solutions. Bergquist BP100-0.005-00-0101 Pk 10 Bond-ply 1"x 1" Sheet