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Introduction To Microsystem Packaging Technology

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
RIP - This product is no longer available on our network. It was last seen on 01.01.2015

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  • Availability: Out Of Stock
  • Supplier: Pickabook
  • SKU: 9781439819104
Availability: In Stock
£73.80
engineering & technology Mathematics, Science, Technology & Medicine > Engineering & Technology
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Product Description

Illustrates developments in microsystem packaging (MSP) design & manufacture, including advanced substrate & interconnection technology. This book also details 3D-package & system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

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Packaging - The outer layer of protection on a product frequently discarded on opening
Design - A drawing or styles that shows the look and functionality of something before its made.

Supplier Information

Pickabook
A UK based company founded in 1998. Offering exceptional value for money on a wide range of books including leather bound books and sticker books.

Over 5 million books in stock - all new
Discounts of upto 80 percent
Excellent customer service
Fast delivery
Page Updated: 2015-03-31 20:45:45

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