The Hyper X Impact SODIMM 8GB series of memory will overclock the highest possible speed by automatically recognising the platform it is connected to which will give your system the boost in speed you are looking for. This HX424S14IB2/8 2400 M Hz memory upgrade totals 8GB in capacity using x 1 memory modules for a truly high capacity upgrade. With low latencies of CL14 & low voltages of 1.2V this Hyper X Impact SODIMM memory is sure to keep your system running cool at all times & all at the fastest possible speeds. With its small hidden black thermal label mounted on top of the SODIMM board this will ensure you memory will run at the optimized temperature all round helping your system run with optimal precision. Key Features
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.25V to 3.6V
- On-Die termination (ODT)
- 16 internal banks; 4 groups of 4 banks each
- Bi-Directional Differential Data Strobe
- 8 bit pre-fetch
- Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop)
- Height 1.18” (30.00mm) Specifications Aluminium Heat Spreader: Yes Intel XMP-Ready Profiles: Yes Memory Capacity: 8GB Model/ Series/ Type: Impact Brand: Hyper X CASLatency: CL14 Chip Organization: x 8 Data

Width: X64 Form Factor: DDR4 Hyper X Range/ Series: Impact Memory

Depth: 1G Memory Voltage: 1.2v Module Type: SODIMM Operating Temperature: 0°C to 85°C Pins: 260 Pin Product Type/ Family: DRAM RAM Memory Type: Non-ECC Rank: 1R (Single Rank) Speed: 2400 M Hz (PC4-19200) Warranty: Lifetime Box Contents 1 x Hyper X HX424S14IB2/8 Impact Black 8GB 2400 M Hz DDR4 Non-ECC CL14 260-pin Unbuffered SODIMM Internal Memory Black














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. .. module. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2400 at a low latency timing of 12-14-14 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.661 inches (42.20mm) Extra Info Memory

Size: 16384MBModule

Size: 16384MBMemory Type: DDR4 Memory Package: DIMMDesignation: PC4-19200 Pin Configuration: 288 pins Main

Colour: Black






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. .. module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-3333 at a low latency timing of 16-18-18 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.661 inches (42.20mm) Extra Info Memory

Size: 16384MBModule

Size: 16384MBMemory Type: DDR4 Memory Package: DIMMPin Configuration: 288 pins Main

Colour: Black






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. .. module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-3600 at a low latency timing of 17-19-19 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.661 inches (42.20mm) Extra Info Memory

Size: 16384MBModule

Size: 16384MBMemory Type: DDR4 Memory Package: DIMMPin Configuration: 288 pins Main

Colour: Black






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. .. FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4-2400 at a low latency timing of 12-14-14 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.661 inches (42.20mm) Extra Info Memory

Size: 16384MBModule

Size: 8192MBMemory Type: DDR4 Memory Package: DIMMDesignation: PC4-19200 Pin Configuration: 288 pins Main

Colour: Black






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. .. FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4-4000 at a low latency timing of 19-21-21 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical Visually striking colours help you immediately spot keys VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.661 inches (42.20mm) Extra Info Memory

Size: 16384MBModule

Size: 8192MBMemory Type: DDR4 Memory Package: DIMMPin Configuration: 288 pins Main

Colour: Black





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. .. FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total capacity is 16GB. Each module has been tested to run at DDR4-4000 at a low latency timing of 19-21-21 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD = 2.4V to 3.3 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Hyper X Infrared Sync working distance 18mm Factory preset RGB wave lighting effect Height 1.661 inches (42.20mm) Extra Info Memory

Size: 16384MBModule

Size: 8192MBMemory Type: DDR4 Memory Package: DIMMPin Configuration: 288 pins Main

Colour: Black






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. .. FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-3333 at a low latency timing of 16-18-18 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical Visually striking colours help you immediately spot keys VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.661 inches (42.20mm) Extra Info Memory

Size: 32768MBModule

Size: 16384MBMemory Type: DDR4 Memory Package: DIMMPin Configuration: 288 pins Main

Colour: Black





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. .. strike fear into the hearts of your foes with Predator DDR4's aggressive, stylish black heat spreader. Boost your frame rate, keep your streams broadcasting smooth, & plow through your highlight reel editing with speeds up to 4000 M Hz paired with quick CL12-CL19 timings. It's available in single module capacities of 8GB-16GB & kits of 2, 4, & 8 with capacities of 8GB-128GB. The Intel XMP-ready profiles are optimized for Intel's latest chipsets
- just select the pro le & you're ready to go. 100-percent factory tested at speed, & backed by a lifetime warranty, dependable Predator DDR4 gives you the best of both worlds: extreme performance & maximum peace of mind. Features High speeds matched with low latencies deliver extreme DDR4 performance Optimized for Intel with XMP-ready profiles Reliability backed by a lifetime warranty Extra Info Memory

Size: 32768MBModule

Size: 16384MBMemory Type: DDR4 Memory Package: DIMMDesignation: PC4-21300 Main

Colour: Black






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. .. FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-2400 at a low latency timing of 12-14-14 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.661 inches (42.20mm) Extra Info Memory

Size: 32768MBModule

Size: 8192MBMemory Type: DDR4 Memory Package: DIMMPin Configuration: 288 pins Main

Colour: Black






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