. .. DDR4 FBGA components. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total capacity is 16GB. This module has been tested to run at DDR4-2933 at a low latency timing of 17-19-19 at 1.2V. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.18 inches (30.00mm) Extra Info Memory

Size: 16384MBModule

Size: 8192MBMemory Type: DDR4 Memory Package: SO-DIMMDesignation: PC4-23400 Pin Configuration: 260 pins Main

Colour: Black






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Available in capacities of up to 64GB, it features low CL13, CL14 & CL15 latencies, higher memory bandwidth & speeds up to 2666 M Hz 1 to power through everything. It auto-overclocks for peak performance & runs efficiently at 1.2V. Optimised for Intel Optimised for Intel’s Series 100 & 200 chipsets to help future-proof your system Key Features
- Optimised for Intel’s Series 100 & 200 chipsets to help future-proof your system
- Automatic overclocking for a hassle-free boost
- XMP-ready profiles for easy custom tuning
- Low 1.2 standard voltage runs more efficiently
- Slim black thermal label & black PCB
- 100% Factory tested





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. .. DDR4 FBGA components. Total kit capacity is 32GB. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. This module has been tested to run at DDR4-2400 at a low latency timing of 14-14-14 at 1.2V. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.18 inches (30.00mm) Extra Info Memory

Size: 32768MBModule

Size: 16384MBMemory Type: DDR4 Memory Package: SO-DIMMDesignation: PC4-19200 Pin Configuration: 260 pins Main

Colour: Black






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. .. DDR4 FBGA components. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total capacity is 32GB. This module has been tested to run at DDR4-2933 at a low latency timing of 17-19-19 at 1.2V. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.18 inches (30.00mm) Extra Info Memory

Size: 32768MBModule

Size: 16384MBMemory Type: DDR4 Memory Package: SO-DIMMDesignation: PC4-23400 Pin Configuration: 260 pins Main

Colour: Black






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. .. DDR4 FBGA components. Total kit capacity is 32GB. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. This module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.18 inches (30.00mm) Extra Info Memory

Size: 32768MBModule

Size: 8192MBMemory Type: DDR4 Memory Package: SO-DIMMPin Configuration: 260 pins Main

Colour: Black






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Hyper X® Impact DDR3 opens up a world of detail that other gamers will never know: the hairs on the back of your victim’s neck, for instance. It automatically recognises the platform that it’s plugged into & auto overclocks to the highest memory frequency published 1 (up to 2133 M Hz) with no need to adjust system BIOS settings. Available in Kits of Two Does your system have enough memory to get you into the game? Kits are available to max out your systems with high-performance goodness. Key Features
- SO-DIMM form factor features stylish & slim thermal label for an easy fit
- Quad channel available
- Easy installation & automatic overclocking; no adjustments in BIOS needed
- Eco-friendly with low voltage settings for cooler & quieter computing
- 100% factory tested




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Available in capacities of up to 64GB, it features low CL13, CL14 & CL15 latencies, higher memory bandwidth & speeds up to 2666 M Hz 1 to power through everything. It auto-overclocks for peak performance & runs efficiently at 1.2V. Optimised for Intel Optimised for Intel’s Series 100 & 200 chipsets to help future-proof your system Key Features
- Optimised for Intel’s Series 100 & 200 chipsets to help future-proof your system
- Automatic overclocking for a hassle-free boost
- XMP-ready profiles for easy custom tuning
- Low 1.2 standard voltage runs more efficiently
- Slim black thermal label & black PCB
- 100% Factory tested





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Hyper X Impact memory boasts a fast SO-DIMM frequency
- 2666 MHz
- to keep you ahead of the curve & level up your game. It automatically

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Hyper X HX316LS9IB/8 is a 1G x 64-bit (8GB) DDR3L-1600 CL9 SDRAM (Synchronous DRAM) 2 Rx 8, low voltage, memory module, based on sixteen 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3L-1600 at a low latency timing of 9-9-9 at 1.35V or 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section below. Impact makes your game hotter while keeping your system cool. It has low voltage settings at 1.35V for less power consumption, reduced heat generation & quiet computing. Its slim, sleek new look lets you stand out in the crowd while the thin thermal label allows for installation in slim or ultra-slim notebooks. Best of all, Hyper X Impact delivers high performance at a low cost. It's gamer-approved & backed by a lifetime warranty, free technical suppot & legendary liability. Key Features SO-DIMM form factor
- features stylish & slim thermal label for an easy fit Easy to install
- automatic overclocking; plug-&-play functionality means no adjustments in BIOS needed Eco-friendly
- low voltage settings for cooler & quieter computing Reliable
- 100-percent factory tested Guaranteed
- lifetime warranty, free technical support Auto overclock up to 2400 M Hz Low voltage setting at 1.35V Slim & sleek new look compatible with ultra-thin notebooks Specifications Capacity: 8 GB Kit Configuration: 1 x 8 GB Speed: PC3-12800 (1600 MHz) Memory Type: DDR3L DIMM Type: 204-Pin SO-DIMM Buffered/ Registered: No Error Correction (ECC): Non-ECC Voltage: 1.35/1.5 V CAS Latency: CL9 Memory Rank: Dual Rank Box Contents 1 x Kingston HX316LS9IB/8 Impact 8 GB 1600 MHz DDR3L CL9 SODIMM 1.35 V SODIMM Notebook Memory Module, Black




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. .. Each module supports Intel Extreme Memory Profiles (Intel XMP) 2.0. This module has been tested to run at DDR4-2933 at a low latency timing of 17-19-19 at 1.2 V Features Power Supply: VDD=1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD=2.2V to 3.6 V On-Die termination (ODT)16 internal banks; 4 groups of 4 banks each Bi-directional Differential Data Strobe 8-bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop) Height 1.18 inches (30.00mm) Extra Info Memory

Size: 8192MBModule

Size: 8192MBMemory Type: DDR4 Memory Package: SO-DIMMDesignation: PC4-23400 Pin Configuration: 260 pins Main

Colour: Black






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