. .. DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-1333 at latency timing 9-9-9 at 1.5V. Features JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 667 M Hz f CK for 1333 Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 9, 8, 7, 6 Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address '000' only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C TCASE. 95°C Asynchronous Reset PCB: Height 1.18 inch (30mm), single sided component Extra Info Memory
Size: 8192MB Module
Size: 4096MB Memory Type: DDR3 Memory Package: DIMM Pin Configuration: 240 pins Main
Colour: White