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HyperX 16GB (2 X 8GB) 1600MHz DDR3 Non-ECC 240 Pin CL9 DIMM PC Memory
Module
HyperX Savage Memory HyperX HX316C9SRK2/16 is a kit of two 1G x 64-bit (8GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 16GB. Each module has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. Note: Please always check the compatibility with manufacturer before purchasing this DRAM module. Certain motherboards may not be compatible with this product and the user should always check system compatibility on the manufacturer's website. Key Features JEDEC standard 1.5V (1.425V ~
1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 800MHz fCK for 1600Mb/sec/pin 8 independent internal banks Programmable CAS latency: 11, 10, 9, 8, 7, 6 Programmable Additive Latency: 0, CL - 2, or CL - 1 clock 8-bit pre-fetch Burst Length: 8 (interleave without any limit, sequential with starting address â000â only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS) Bi-directional Differential Data Strobe Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C TCASE 95°Cº Asynchronous Reset Height 1.311â (33.30mm), w/heatsink, double sided component
1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 800MHz fCK for 1600Mb/sec/pin 8 independent internal banks Programmable CAS latency: 11, 10, 9, 8, 7, 6 Programmable Additive Latency: 0, CL - 2, or CL - 1 clock 8-bit pre-fetch Burst Length: 8 (interleave without any limit, sequential with starting address â000â only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS) Bi-directional Differential Data Strobe Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C TCASE 95°Cº Asynchronous Reset Height 1.311â (33.30mm), w/heatsink, double sided component
%201600MHz%20DDR3%20Non-ECC%20240%20Pin%20CL9%20DIMM%20PC%20Memory%20Module "Pin It")
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