- Ideal for music on the move
- Fold & flip registered design allows the ear cups to be turned through 90deg & fold the headphones

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A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical & water resistance Meets the requirements of WEEE & Ro HS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting & encapsulating compound it is a safer alternativve to the popular PX700 & can be used for the same applications.PX804C has a long usable life & may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm & low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress & this makes PX804C compatible with most circuit board components & materials over a wide temperature range. Adhesion is excellent to most plastics & substrates. The combination of properties & the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals & is available in 50g 250g 500g & 1kg form. The finish colour is black.

Specification Colour Black Specific Gravity g ml 1.7 Viscosity m. P a.s 25 C 9000 Approvals Ro HS compliant Yes UL94-V0 Yes REACH SVHC concentration 0 Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40 Shrinkage volume 0.3 Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 k Vmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80 Flamm ability UL94 -VO 3 mm T ensile strength 50 m Pa Compressive strength 60 m Pa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50 Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5

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A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical & water resistance Meets the requirements of WEEE & Ro HS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting & encapsulating compound it is a safer alternativve to the popular PX700 & can be used for the same applications.PX804C has a long usable life & may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm & low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress & this makes PX804C compatible with most circuit board components & materials over a wide temperature range. Adhesion is excellent to most plastics & substrates. The combination of properties & the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals & is available in 50g 250g 500g & 1kg form. The finish colour is black.

Specification Colour Black Specific Gravity g ml 1.7 Viscosity m. P a.s 25 C 9000 Approvals Ro HS compliant Yes UL94-V0 Yes REACH SVHC concentration 0 Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40 Shrinkage volume 0.3 Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 k Vmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80 Flamm ability UL94 -VO 3 mm T ensile strength 50 m Pa Compressive strength 60 m Pa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50 Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5

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A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical & water resistance Meets the requirements of WEEE & Ro HS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting & encapsulating compound it is a safer alternativve to the popular PX700 & can be used for the same applications.PX804C has a long usable life & may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm & low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress & this makes PX804C compatible with most circuit board components & materials over a wide temperature range. Adhesion is excellent to most plastics & substrates. The combination of properties & the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals & is available in 50g 250g 500g & 1kg form. The finish colour is black.

Specification Colour Black Specific Gravity g ml 1.7 Viscosity m. P a.s 25 C 9000 Approvals Ro HS compliant Yes UL94-V0 Yes REACH SVHC concentration 0 Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40 Shrinkage volume 0.3 Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 k Vmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80 Flamm ability UL94 -VO 3 mm T ensile strength 50 m Pa Compressive strength 60 m Pa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50 Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5

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A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical & water resistance Meets the requirements of WEEE & Ro HS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting & encapsulating compound it is a safer alternativve to the popular PX700 & can be used for the same applications.PX804C has a long usable life & may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm & low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress & this makes PX804C compatible with most circuit board components & materials over a wide temperature range. Adhesion is excellent to most plastics & substrates. The combination of properties & the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals & is available in 50g 250g 500g & 1kg form. The finish colour is black.

Specification Colour Black Specific Gravity g ml 1.7 Viscosity m. P a.s 25 C 9000 Approvals Ro HS compliant Yes UL94-V0 Yes REACH SVHC concentration 0 Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40 Shrinkage volume 0.3 Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 k Vmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80 Flamm ability UL94 -VO 3 mm T ensile strength 50 m Pa Compressive strength 60 m Pa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50 Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5

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- Ideal for burning designs into wood & leather
- Can be used to create pictures or decorate key rings leather belts book marks

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- Slim h&-held machine
- 8 character LCD display
- 8 print styles 6 print sizes 4 border styles
- Vertical & mirror printing
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- Slim h&-held machine
- Ideal for printing high quality labels
- Ideal for home office cables garage & lots more
- Supplied



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- Provides water-tight seal
- 12mm width x 12m length A toolbox essential for ensuring threaded seals are water-tight. Wrap

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