Excellent performance Wide temperature resistance range High thermal conductivity Low thermal resistance Low electrical conductivity UPerfect PerformanceUbrbrTG2 has excellent thermal dissipation performance and provides high thermal conductivity low thermal resistance and low electrical conductivity the TG2 keeps the same good performance when used over time.
Diamond particles measuring 0.0000015 cm rated at 8.3 wmKExtended -50C to 250C stable temperature range ideal for performance coolingLighter easier to spread stable composition wont crack or dry outQuantity 4 gSpecific gravity 2.8 g cm3 Antecs Formula 7 nano diamond thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPUs surface actually touches the heat sink you need a solution that not only facilitates the transfer of heat but also prevents heat from escaping. Formula 7s nano diamond particlesbrprovide a smooth layer that minimizes the distance between heat-conductive compoundsa feat other standard metal-based compounds are not capable of. Such a layer has a diamond concentration that is more than double that of similar products. Formula 7 is the most durable product on the market in that is light and easy enough to apply without cracking or drying out. In addition it optimally performs between -50C to 250C giving you an irreplaceable reliable gel that welcomes overclocking. To keep your system cool and your CPU functioning comfortably pick up Antecs Formula 7 for a diamond-caliber solution.