A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical and water resistance Meets the requirements of WEEE and RoHS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting and encapsulating compound it is a safer alternativve to the popular PX700 and can be used for the same applications.PX804C has a long usable life and may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm and low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress and this makes PX804C compatible with most circuit board components and materials over a wide temperature range. Adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals and is available in 50g 250g 500g and 1Kg form. The finish colour is black. Specification Colour Black Specific Gravity g ml 1.7Viscosity m. P a.s 25 C 9000Approvals RoHS compliant Yes UL94-V0 Yes REACH SVHC concentration 0Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40Shrinkage volume 0.3Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 kVmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80Flamm ability UL94 -VO 3 mm T ensile strength 50 mPa Compressive strength 60 mPa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5
A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical and water resistance Meets the requirements of WEEE and RoHS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting and encapsulating compound it is a safer alternativve to the popular PX700 and can be used for the same applications.PX804C has a long usable life and may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm and low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress and this makes PX804C compatible with most circuit board components and materials over a wide temperature range. Adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals and is available in 50g 250g 500g and 1Kg form. The finish colour is black. Specification Colour Black Specific Gravity g ml 1.7Viscosity m. P a.s 25 C 9000Approvals RoHS compliant Yes UL94-V0 Yes REACH SVHC concentration 0Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40Shrinkage volume 0.3Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 kVmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80Flamm ability UL94 -VO 3 mm T ensile strength 50 mPa Compressive strength 60 mPa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5
A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical and water resistance Meets the requirements of WEEE and RoHS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting and encapsulating compound it is a safer alternativve to the popular PX700 and can be used for the same applications.PX804C has a long usable life and may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm and low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress and this makes PX804C compatible with most circuit board components and materials over a wide temperature range. Adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals and is available in 50g 250g 500g and 1Kg form. The finish colour is black. Specification Colour Black Specific Gravity g ml 1.7Viscosity m. P a.s 25 C 9000Approvals RoHS compliant Yes UL94-V0 Yes REACH SVHC concentration 0Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40Shrinkage volume 0.3Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 kVmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80Flamm ability UL94 -VO 3 mm T ensile strength 50 mPa Compressive strength 60 mPa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5
A good alternative to PX700K High electrical insulating characteristics Non-toxic Good thermal conductivity Low shrinkage High adhesion Flame retardant to UL94-V0 3mm Good chemical and water resistance Meets the requirements of WEEE and RoHS This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting and encapsulating compound it is a safer alternativve to the popular PX700 and can be used for the same applications.PX804C has a long usable life and may be hot or cold cured. The system exhibits good surface finish high electrical strength good thermal conductivity low exotherm and low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress and this makes PX804C compatible with most circuit board components and materials over a wide temperature range. Adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals and is available in 50g 250g 500g and 1Kg form. The finish colour is black. Specification Colour Black Specific Gravity g ml 1.7Viscosity m. P a.s 25 C 9000Approvals RoHS compliant Yes UL94-V0 Yes REACH SVHC concentration 0Mix ratio by weight 8.6 1 Mix ratio by volume 4.8 1 Useable life 15 0g 25 C 120 Minutes Gel time 1 50 g 2 5 C 360 minutes Cure Schedule Minimum cure Full cure 24 hrs 20 C 1 w eek 2 hr s 6 0 C 4 hour s 1 hr 8 0 C 2 hours Typical Prope rties Peak exotherm 1 50 g 2 5 C 40Shrinkage volume 0.3Thermal conductivity 0.85 Wm K Operating temperature range -5 5 to 13 0 C application amp geometry dependent Electric strength 18 kVmm Volume Resistivity 11 Log 10 ohm -cm Shore D hardness 80Flamm ability UL94 -VO 3 mm T ensile strength 50 mPa Compressive strength 60 mPa Deflection Temperature 50 C Co-efficient of expansion 35 -5 5 ppm C Loss Tangent 0.060 50Hz Permittivity 4.8 50 Hz Continuous tr acking ind ex 850 V Water absorption 0.3 30 d ays 20 C Elongation at break 2-5