Advanced Solderless Breadboard SystemA range of solderless breadboard modules that can interconnect to suit individual requirements. The basic board AD-01 consists of four blocks of six columns of 28 rows the sockets in each row being interconnected. The blocks are a standard DIP size apart although MSI and LSI type chips can be used. At both ends of the blocks there are two power busses. The Red bus is made up of two separate rows of 12 connecting sockets and the Black bus is one row of 24 connecting sockets.There is an additional
Advanced Solderless Breadboard SystemA range of solderless breadboard modules that can interconnect to suit individual requirements. The basic board AD-01 consists of four blocks of six columns of 28 rows the sockets in each row being interconnected. The blocks are a standard DIP size apart although MSI and LSI type chips can be used. At both ends of the blocks there are two power busses. The Red bus is made up of two separate rows of 12 connecting sockets and the Black bus is one row of 24 connecting sockets.There is an additional
Advanced Solderless Breadboard SystemA range of solderless breadboard modules that can interconnect to suit individual requirements. The basic board AD-01 consists of four blocks of six columns of 28 rows the sockets in each row being interconnected. The blocks are a standard DIP size apart although MSI and LSI type chips can be used. At both ends of the blocks there are two power busses. The Red bus is made up of two separate rows of 12 connecting sockets and the Black bus is one row of 24 connecting sockets.There is an additional
Advanced Solderless Breadboard SystemA range of solderless breadboard modules that can interconnect to suit individual requirements. The basic board AD-01 consists of four blocks of six columns of 28 rows the sockets in each row being interconnected. The blocks are a standard DIP size apart although MSI and LSI type chips can be used. At both ends of the blocks there are two power busses. The Red bus is made up of two separate rows of 12 connecting sockets and the Black bus is one row of 24 connecting sockets.There is an additional
A kit containing 14 different length jumper wires for use with our plugblocks. Wires are stripped and formed at 90 at each end. There are 25 wires of each length2.54mm 0.1in. uninsulated 58mm 0.2in. 7.62mm 0.3in. 10.16mm 0.4in. 12.7mm 0.5in. 15.24mm 0.6in. 17.78mm 0.7in. 20.32mm 0.8in. 22.86mm 0.9in. 25.4mm 1in. 50.8mm 2in. 76.2mm 3in. 101.6mm 4in. 127mm 5in..Wires are supplied in various colours. They are 23swg solid tinned copper wire supplied in an attractive plastic case with a blue base and clear hinged lid with each length wire in a separate compartment. Overall size of box 270 x 124 x 30mm high.
This breadboard consists of two sections one section of 30 blocks of six rows labelled A to F and an identical section labelled G to L. Can be connected to AD-01BZ13P AD-4DAG07H AD-10BZ12N AD-101AG09K and AD-102AG10L or other blocks of AD-100AG08J.Dimensions 42 x 83 x 10mm.
This breadboard is constructed from one of AD-4DAG07H and one of AD-100AG08J complete with a self-adhesive pad for attaching to a suitable surface. The breadboard can also be attached to AD-01BZ13P AD-4DAG07H AD-10BZ12N AD-100AG08J and AD-102AG10L or other blocks of AD-101. Dimensions 83x52x10mm.
This breadboard is constructed from two of AD-4DAG07H and one of AD-100AG08J in between. A self-adhesive pad is attached to the rear of the breadboard.Can also be connected to AD-01BZ13P AD-4DAG07H AD-10BZ12N AD-100AG08J AD-101AG09K or other AD-102 blocks. Dimensions 62x83x10mm.
A plugblock comprising one RH-10S and two RH5DS plugblocks mounted on an attractive blue base with three terminal posts and a component bracket. This unit thus provides a total of 840 contacts. Specification as RH-10S above.Dimensions 190x118x19mm thick.
Advanced Solderless Breadboard SystemA range of solderless breadboard modules that can interconnect to suit individual requirements. The basic board AD-01 consists of four blocks of six columns of 28 rows the sockets in each row being interconnected. The blocks are a standard DIP size apart although MSI and LSI type chips can be used. At both ends of the blocks there are two power busses. The Red bus is made up of two separate rows of 12 connecting sockets and the Black bus is one row of 24 connecting sockets.There is an additional
A plugblock comprising two RH-10S and three RH- 5DS plugblocks mounted on an attractive blue base with three terminal posts and a component bracket. This unit thus provides a total of 1580 contacts. Specifications as RH-10S above. Dimensions 190x168x19mm thick.
A high quality plugblock with silver-plated contacts for low contact resistance. The plugblock has a total of 640 contacts arranged in two blocks of 64 rows of 5 interconnected sockets on a 2.54 x 2.54mm matrix. The distance between the two centre rows of sockets is 7.62mm and the block will hold up to nine 14-pin DIL packages for example. All contact positions are clearly marked on an alpha-numeric grid. Fixing is by self-adhesive foam insulating strip on the base of the block.Specifications Body materialABS polymerContact resistance1mOmegaContact rating1AContactsSilver-plated nickel-silverContact life5000 insertionsAccepts wires0.3 to 0.8mm diameterDimensions172 x 38.5 x 8mm thick