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Width: 50%; }. rpd-img { text-align:center; } Plug & play Get the speed you want, hassle free. Hyper X FURY DDR4 is the first product line to offer automatic overclocking up to the highest frequency published. Optimised for Intel’s 200 Series & X99 chipsets Hyper X FURY DDR4 memory is 100% tested & optimised for compatibility & easy overclocking. To complete a motherboard featuring 200 Series or X99 chipsets, you need the latest generation of DRAM technology – DDR4 memory. Low power consumption DDR4’s lower power requirements mean less heat & higher reliability. Low 1.2 volts draw less power from your system, which results in a cooler & quieter PC. Low-profile stylish heat spreader Stand out from the crowd & show your style with FURY’s asymmetrical signature heat spreader. Available in black, red & white with black PCB, FURY DDR4’s low profile heat spreader will fit under oversized CPU coolers while enhancing heat dissipation for lasting reliability. Hyper X Fury 16GB (2X8GB) DDR4 2133 M Hz CL14 DIMM Black Memory Kit DESCRIPTION Hyper X HX421C14FB2K2/16 is a kit of two 1G x 64-bit (8GB) DDR4-2133 CL14 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4-2133 at a low latency timing of 14-14-14 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (Pn P) Timing Parameters section below. The JEDEC standard electrical & mechanical specifications are as follows: Note: The Pn P feature offers a range of speed & timing options to support the widest variety of processors & chipsets. Your maximum speed will be determined by your BIOS. JEDEC/XMP TIMING PARAMETERS JEDEC/ Pn P: DDR4-2133 CL14-14-14 @1.2V XMP Profile 1: DDR4-2133 CL14-14-14 @1.2V SPECIFICATIONS CL (IDD) 14 cycles Row Cycle Time (t R Cmin) 46.5ns (min.) Refresh to Active/ Refresh Command Time (t RFCmin) 350ns (min.) Row Active Time (t RASmin) 32.75ns (min.) Maximum Operating Power TBD W* UL Rating 94 V
- 0 Operating Temperature 0oC to +85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES Power Supply: VDD = 1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD = 2.2V to 3.6V Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals Low-power auto self refresh (LPASR) Data bus inversion (DBI) for data bus On-die VREFDQ generation & calibration Single-rank On-board I2 serial presence-detect (SPD) EEPROM 16 internal banks; 4 groups of 4 banks each Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Fly-by topology Terminated control command & address bus Height 1.340” (34.04mm), w/o heatsink