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MSI MPG X570S CARBON MAX WIFI AM4 ATX Motherboard
Features • Supports AMD Ryzen 5000 series, 5000 G-series, 4000 G-series, 3000 series, 3000 G-series, 2000 series and 2000 G-series desktop processors • Supports DDR4 Memory, up to 5300+(OC) MHz • Lightning Fast Game experience: PCIe 4.0, Lightning Gen 4 x4 M.2, USB 3.2 Gen 2 • Enhanced Power Design: 14+2 Duet Rail Power System, 8-pin plus 4-pin CPU power connectors, Core Boost, DDR4 Boost • Premium Thermal Solution: Aluminum cover, heat-pipe, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and M.2 Shield Frozr are built for high performance system and non-stop gaming experience • MYSTIC LIGHT: 16.8 million colors / 29 effects controlled in one click. MYSTIC LIGHT EXTENSION supports both RGB and RAINBOW LED strip. • 2.5G
LAN with LAN Manager and Intel Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection • AUDIO BOOST 5: Reward your ears with studio grade sound quality for the most immersive gaming experience • High Quality PCB: 6-layer PCB made by 2oz thickened copper and server grade level material • Pre-installed I/O Shield: Better EMI protection and more convenience for installation A step into the Future Take a step into the future with The MSI X570S CARBON MAX Wifi, here to support the very latest AMD Ryzen processors; bolstered with an arsenal of top-shelf modern features like; the latest 4th gen PCI-e and M.2 technologies, Type-C connectivity, DDR4 Memory boosts, a premium thermal design including
aluminium cover, VRM heatpipes and MOSFET baseplate Plus onboard M.2 Shield Frozr and incredible Wi-Fi 6e technology. The MSI X570S motherboards have what it takes to push the boundaries of performance into unknown territories, so buckle up and get ready for the ride of your life. Digital PWM An aggressive digital VRM power design with digital PWM IC and 14 Duet Rail CPU Power System with 75A Smart Power Stage, make sure your system runs smoothly under the most extreme conditions 2oz Thickened Copper PCB An enhanced PCB design improves heat dissipation and performance reliability. 14 + 2 DUET RAIL POWER SYSTEM Unleash and sustain maximum performance with an aggressive VRM design built with a total of 14 Duet Rail Power System(DRPS). Combining 8+4-pin power connectors and exclusive Core
Boost technology, MPG series motherboard is ready to sustain heavy daily work. Impeccable Thermal Design With newer processors housing more cores, thermal and power design becomes for important to ensure temperatures remain stable. MSI have incorporated extended PWM heatsinks, heatpipes and enhanced circuit design to ensure even high-end CPUs run at full capacity with MSI motherboards. faster and undistorted current delivery Core Boost technology combines MSI’s premium layout and digital power design which allows for faster and undistorted current delivery to the CPU at pin-point precision. Not only supporting multi-core CPUs, but also creating the perfect conditions for CPU overclocking allowing you to always get the most from your 3rd generation AMD Ryzen Processor. LIGHTNING
GEN 4 PCI-E MSI lightning Gen 4 PCI-E is the latest and the fastest PCI-E data transfer solution with 64GB/s of unidirectional transfer bandwidth that has doubled compared to its previous generation. PCIe 4.0 maintains both backward and forward compatibility with older and newer specifications. Optimised by steel armor design and server grade PCB, you can enjoy next-gen devices without any
LAN with LAN Manager and Intel Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection • AUDIO BOOST 5: Reward your ears with studio grade sound quality for the most immersive gaming experience • High Quality PCB: 6-layer PCB made by 2oz thickened copper and server grade level material • Pre-installed I/O Shield: Better EMI protection and more convenience for installation A step into the Future Take a step into the future with The MSI X570S CARBON MAX Wifi, here to support the very latest AMD Ryzen processors; bolstered with an arsenal of top-shelf modern features like; the latest 4th gen PCI-e and M.2 technologies, Type-C connectivity, DDR4 Memory boosts, a premium thermal design including
aluminium cover, VRM heatpipes and MOSFET baseplate Plus onboard M.2 Shield Frozr and incredible Wi-Fi 6e technology. The MSI X570S motherboards have what it takes to push the boundaries of performance into unknown territories, so buckle up and get ready for the ride of your life. Digital PWM An aggressive digital VRM power design with digital PWM IC and 14 Duet Rail CPU Power System with 75A Smart Power Stage, make sure your system runs smoothly under the most extreme conditions 2oz Thickened Copper PCB An enhanced PCB design improves heat dissipation and performance reliability. 14 + 2 DUET RAIL POWER SYSTEM Unleash and sustain maximum performance with an aggressive VRM design built with a total of 14 Duet Rail Power System(DRPS). Combining 8+4-pin power connectors and exclusive Core
Boost technology, MPG series motherboard is ready to sustain heavy daily work. Impeccable Thermal Design With newer processors housing more cores, thermal and power design becomes for important to ensure temperatures remain stable. MSI have incorporated extended PWM heatsinks, heatpipes and enhanced circuit design to ensure even high-end CPUs run at full capacity with MSI motherboards. faster and undistorted current delivery Core Boost technology combines MSI’s premium layout and digital power design which allows for faster and undistorted current delivery to the CPU at pin-point precision. Not only supporting multi-core CPUs, but also creating the perfect conditions for CPU overclocking allowing you to always get the most from your 3rd generation AMD Ryzen Processor. LIGHTNING
GEN 4 PCI-E MSI lightning Gen 4 PCI-E is the latest and the fastest PCI-E data transfer solution with 64GB/s of unidirectional transfer bandwidth that has doubled compared to its previous generation. PCIe 4.0 maintains both backward and forward compatibility with older and newer specifications. Optimised by steel armor design and server grade PCB, you can enjoy next-gen devices without any
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