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Kingston 24GB (6x4GB) DDR3 1600mhz Hyperx Xmp T1 Memory Kit
Kingstons KHX1600C9D3T1BK6/24GX is a kit of six 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM), 2Rx8 memory modules, based on sixteen 256M x 8-bit FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 24GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are as follows: Technical Specifications: JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 667MHz fCK for 1333Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 9-8-7-6 Programmable
Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7 (DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does notallow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal(self) calibration: Internal self calibration through ZQ Pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C Asynchronous Reset PCB: Height 2.401” (61.00mm) w/ heatsink, double sided component CL(IDD): 9 cycles Row Cycle Time (tRCmin): 49.5ns (min.) Refresh to Active/Refresh: 160ns (min.) Row Active Time
(tRASmin): 36ns (min.) Power (Operating): 1.410 W (per module) UL Rating: 94 V - 0 Operating Temperature: 0oC to 85oC Storage Temperature: -55oC to +100o C
Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7 (DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does notallow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal(self) calibration: Internal self calibration through ZQ Pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C Asynchronous Reset PCB: Height 2.401” (61.00mm) w/ heatsink, double sided component CL(IDD): 9 cycles Row Cycle Time (tRCmin): 49.5ns (min.) Refresh to Active/Refresh: 160ns (min.) Row Active Time
(tRASmin): 36ns (min.) Power (Operating): 1.410 W (per module) UL Rating: 94 V - 0 Operating Temperature: 0oC to 85oC Storage Temperature: -55oC to +100o C
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