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Kingston 12GB (6 X 2GB) 1600MHz DDR3 Non-ECC CL9 HyperX Memory
Kingston is the worlds largest independent memory manufacturer. In todays performance-driven environment, memory upgrades provide an easy, economical alternative to increase system performance. Every memory product Kingston offers is designed to help you get maximum performance at the best price to you. Engineered and tested to deliver extreme performance, HyperX easily endures the most rigorous demands of any creative professional, gamer or PC enthusiast. Technical Specification CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh 110ns Command Time (tRFCmin) Row Active Time (tRASmin) 36ns (min.) Power 1.080 W (operating per module) UL Rating 94 V - 0 Operating Temperature 0° C to 85° C Storage Temperature -55° C to +100° C Features JEDEC
standard 1.5V ± 0.075V Power Supply VDDQ = 1.5V ± 0.075V 667MHz fCK for 1333Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 5, 6, 7, 8, 9, 10 Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7(DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal(self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C Asynchronous
Reset PCB: Height 1.180” (30.00mm), double sided component
standard 1.5V ± 0.075V Power Supply VDDQ = 1.5V ± 0.075V 667MHz fCK for 1333Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 5, 6, 7, 8, 9, 10 Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7(DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal(self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C Asynchronous
Reset PCB: Height 1.180” (30.00mm), double sided component
%201600MHz%20DDR3%20Non-ECC%20CL9%20HyperX%20Memory "Pin It")
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