Hyper X FURY DDR4 memory automatically overclocks up to 1866 M Hz for hassle-free, plug-&-play functionality that gets you in the game faster & instant top-level performance that helps you win it. With voltages as low as 1.35V, it draws less power & generates less heat, while supporting Intels 100 series chipset. Its asymmetric, aggressive design lets you stand out from the crowd of "squared" designs & features quality aluminum & a diamond-cut finish. Plug & play Get the speed you want, hassle free. Hyper X FURY DDR4 is the first product line to offer automatic overclocking up to the highest frequency published. Low power consumption DDR4s lower power requirements mean less heat & higher reliability. Low 1.2 volts draw less power from your system, which results in a cooler & quieter PC. Low profile stylish heat spreader Stand out from the crowd & show your style with FURYs asymmetrical signature heat spreader. ...

Get the upgrade that you need to kick your system’s performance & style into high gear with the Hyper X® FURY RGB SSD. The drive features a smooth, stunning light bar to give your computer a dash of dazzling RGB lighting. It can also daisy-chain to other RGB devices to sync colours & effects 1. Cutting-edge 3D NAND & a Marvell controller give the FURY RGB incredible speeds of 550 MB/s write & 480MB/s read 2 while also making the drive more durable & more efficient. With a top case designed to accentuate its lighting, FURY RGB is the premier SSD for computer builders who don’t want to skimp on performance or looks. Dazzling, dynamic RGB effects Improve your system’s performance & looks! Daisy-chain to other RGB devices Sync up RGB effects across your system internals for a rig that any builder would envy. Up to 10x faster than a hard drive Cutting-edge 3D NAND technology pumps out incredible performance. Aggressive styling Separate yourself from blocky, squared builds with FURY RGB’s fierce design. ...

Hyper X Genesis sets the standard in high-performance memory. Like all Hyper X products, Genesis modules are specifically engineered & designed to meet the rigorous requirements of PC enthusiasts. Genesis offers greater thermal performance, higher frequency speed & lower latency. It′s available in DDR3 in single, dual, triple & quad channel memory kits. It offers impressive speeds up to 2400 M Hz & capacities up to 64GB. Hyper X Genesis is backed by a lifetime warranty & free technical support. ...

Hyper X HX424C15FB/4 is a 512M x 64-bit (4GB) DDR4-2400 CL15 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (Pn P) Timing Parameters section below. The JEDEC standard electrical & mechanical specifications are as follows: EDEC/ Pn P: DDR4-2400 CL15-15-15 @1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 46.75ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 29.125ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heatsink


























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Hyper X HX426C15FB/4 is a 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 45ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 26.25ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heatsink


























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Hyper X HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles Intel XMP) 2.0. Total kit capacity is 8GB. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Specifications:
- CL (IDD) 15 cycles
- Row Cycle Time (t R Cmin) 45ns (min.)
- Refresh to Active/ Refresh Command Time (t RFCmin) 260ns (min.)
- Row Active Time (t RASmin) 26.25ns (min.)
- UL Rating 94 V
- 0
- Operating Temperature 0 oC to +85 o C
- Storage Temperature -55 oC to +100 oC

Features:
- Power Supply: VDD = 1.2V Typical
- VDDQ = 1.2V Typical
- VPP
- 2.5V Typical
- VDDSPD = 2.2V to 3.6V
- Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals
- Low-power auto self refresh (LPASR)
- Data bus inversion (DBI) for data bus
- On-die VREFDQ generation & calibration
- Single-rank
- On-board I2 serial presence-detect (SPD) EEPROM
- 16 internal banks; 4 groups of 4 banks each
- Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS)
- Selectable BC4 or BL8 on-the-fly (OTF)
- Fly-by topology
- Terminated control command & address bus
- Height 1.340” (34.04mm), w/heatsink


























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Hyper X Beast is part of the premiere memory line offered from Hyper X memory. It's heat spreader design & PCB colour adds boldness to any gamer, PC enthusiast or content creator's system. With high-performance hardware & innovative designs, Hyper X Beast shatters expectations. Hyper X Beast memory features a dynamic & vicious heat spreader that maximises thermal dissipation for increased reliability & a matching black PCB for a cool, aggressive look that enhances any enthusiasts' system. ...

Attack the competition with Hyper X Savage memory. Its unique, asymmetrical red heat spreader is made from high-quality aluminum & has a black PCB & a diamond cut finish to make your game shine & help you stand out in the crowd. The heat spreader dissipates heat so your system stays cool & reliable & its low profile fits under oversized CPU coolers. Featuring a design that works well with the latest trends in gaming, Hyper X Savage comes in a wide range of high-performance speeds, from 1600 M Hz to 2400 M Hz, & capacities from 4GB to 8GB in single modules & 8GB to 32GB kits. In CL9-CL11 latencies, it delivers ultra-responsive multitasking & an overall faster system. Dual & quad channel kits are available. Built-in, h&-tuned XMP profiles let users reach higher-performing frequencies, timings & voltages simply by enabling Intel's XMP tool. Even noobs can overclock their platforms with no need for manual adjustments in BIOS. Hyper X Savage is backed by a lifetime warranty & free technical support. ...

Hyper X Fury 8GB 2400 M Hz DDR4 CL15 DIMM Black Memory DESCRIPTION Hyper X HX424C15FB2/8 is a 1G x 64-bit (8GB) DDR4-2400 CL15 SDRAM (Synchronous DRAM) 1 Rx 8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Each module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (Pn P) Timing Parameters section below. The JEDEC standard electrical & mechanical specifications are as follows: Note: The Pn P feature offers a range of speed & timing options to support the widest variety of processors & chipsets. Your maximum speed will be determined by your BIOS. JEDEC/XMP TIMING PARAMETERS JEDEC/ Pn P: DDR4-2400 CL15-15-15 @1.2V DDR4-2133 CL14-14-14 @1.2V XMP Profile 1: DDR4-2400 CL15-15-15 @1.2V SPECIFICATIONS CL (IDD) 15 cycles Row Cycle Time (t R Cmin) 46.75ns (min.) Refresh to Active/ Refresh Command Time (t RFCmin) 350ns (min.) Row Active Time (t RASmin) 29.125ns (min.) Maximum Operating Power TBD W* UL Rating 94 V
- 0 Operating Temperature 0oC to +85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES Power Supply: VDD = 1.2V Typical VDDQ = 1.2V Typical VPP
- 2.5V Typical VDDSPD = 2.2V to 3.6V Nominal & dynamic on-die termination (ODT) for data, strobe, & mask signals Low-power auto self refresh (LPASR) Data bus inversion (DBI) for data bus On-die VREFDQ generation & calibration Single-rank On-board I2 serial presence-detect (SPD) EEPROM 16 internal banks; 4 groups of 4 banks each Fixed burst chop (BC) of 4 & burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Fly-by topology Terminated control command & address bus Height 1.340” (34.04mm), w/o heatsink

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