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Gigabyte AMD B550I AORUS PRO AX Mini-ITX Motherboard
Rise From the Darkness Introducing the all-new AORUS PRO AX B550I Motherboard from Gigabyte. Perfect performance for those who prefer a smaller form factor. Filled with the latest technologies to take your gaming experience to the next level such as PCI-E 4.0 technology to give you better performance, bandwidth and eye-watering speeds, incredible Wi-Fi 6 module with BlueTooth 5 module and AORUS antenna, 2x M.2 slots with thermal guards, USB 3.2 gen2 Type C connectivity and a high-quality audio system. Illuminate your system in your own style with Gigabytes RGB Fusion software or even have supported devices be interactive with the new gaming mode to give yourself that additional immersive gaming experience. The AORUS B550I PRO AX is designed to unleash the full potential of the 3rd
Generation Ryzen CPUs, give your system the strongest foundations and make your friends and enemies envious of the power you now hold. Keep Your Components Cool In order to guarantee un-throttled performance AORUS have opted for an advanced thermal solution, including Pre-installed IO Armour and enlarged MOSFET heatsink with additional groves to improve airflow, an additional M.2 heatpipe, a multi-layered heatsink for your m.2 SSD and a thermal baseplate for the entire board meaning the B550I PRO AX is capable of keeping the MOSFETs and M.2 SSDs cool and comfortable even under maximum load. Whether youre a gamer, builder or just an enthusiast you can expect lower temperatures and higher performance from the B550I PRO AX. 8 Phase Digital Power Design In order to fully support 3rd
Generation AMD Ryzen CPUs, the AORUS B550I PRO AX comes equipped with the most complete power solution yet, with true direct, digital and multiple power phases, birthed from countless experiments, testing and tinkering the B550I PRO AX uses a total 6+2 phases for Vcore and SOC, is capable of providing 90A from each phase and a total of 720A power design. With 8 Solid-pin CPU Power Connectors offer incredible precision and stability in delivering power to the motherboards most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum overclocking performance from 3rd Gen AMD Ryzen™ processors. 2X COPPER PCB GIGABYTEs exclusive 2X Copper PCBs design provides sufficient power trace paths between components to handle greater than normal power
loads and to remove heat from the critical CPU power delivery area. This is essential to ensure the motherboard is able to handle the increased power loading that is necessary when overclocking. Support for DDR4 XMP Up to 5300MHz and Beyond AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5300MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard. Please see the complete validated memory support list. Product features may vary by model. 2.5 GbE Onboard LAN Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least two times faster transfer speeds as compared to general 1GbE
networking. It’s perfectly suit for gamers and streamer with ultimate and smooth online experience. 2.5G LAN is also backward compatible with Multi-Gig (10/100/1000/2500Mbps)of RJ-45 ethernet.
Generation Ryzen CPUs, give your system the strongest foundations and make your friends and enemies envious of the power you now hold. Keep Your Components Cool In order to guarantee un-throttled performance AORUS have opted for an advanced thermal solution, including Pre-installed IO Armour and enlarged MOSFET heatsink with additional groves to improve airflow, an additional M.2 heatpipe, a multi-layered heatsink for your m.2 SSD and a thermal baseplate for the entire board meaning the B550I PRO AX is capable of keeping the MOSFETs and M.2 SSDs cool and comfortable even under maximum load. Whether youre a gamer, builder or just an enthusiast you can expect lower temperatures and higher performance from the B550I PRO AX. 8 Phase Digital Power Design In order to fully support 3rd
Generation AMD Ryzen CPUs, the AORUS B550I PRO AX comes equipped with the most complete power solution yet, with true direct, digital and multiple power phases, birthed from countless experiments, testing and tinkering the B550I PRO AX uses a total 6+2 phases for Vcore and SOC, is capable of providing 90A from each phase and a total of 720A power design. With 8 Solid-pin CPU Power Connectors offer incredible precision and stability in delivering power to the motherboards most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum overclocking performance from 3rd Gen AMD Ryzen™ processors. 2X COPPER PCB GIGABYTEs exclusive 2X Copper PCBs design provides sufficient power trace paths between components to handle greater than normal power
loads and to remove heat from the critical CPU power delivery area. This is essential to ensure the motherboard is able to handle the increased power loading that is necessary when overclocking. Support for DDR4 XMP Up to 5300MHz and Beyond AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5300MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard. Please see the complete validated memory support list. Product features may vary by model. 2.5 GbE Onboard LAN Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least two times faster transfer speeds as compared to general 1GbE
networking. It’s perfectly suit for gamers and streamer with ultimate and smooth online experience. 2.5G LAN is also backward compatible with Multi-Gig (10/100/1000/2500Mbps)of RJ-45 ethernet.
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