Kingstons KHX24C11T1K2/8X is a kit of two 512M x 64-bit (4GB) DDR3-2400 CL11 SDRAM (Synchronous DRAM), 2 Rx 8 memory modules, based on sixteen 256M x 8-bit FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-2400 at a low latency timing of 11-13-13 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers. Features JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 667 M Hz f CK for 1333 Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 9, 8, 7, 6 Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock Programmable CAS Write Latency (CWL) = 7 (DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C Asynchronous Reset PCB: Height 2.401” (61.00mm) w/ heatsink, double sided component Specifications CL (IDD): 9 cycles Row Cycle Time (t R Cmin): 49.5ns (min.) Refresh to Active/ Refresh: 160ns (min.) Row Active Time (t RASmin): 36ns (min.) Maximum Operating Power: 2.400 W* (per module) UL Rating: 94 V
- 0 Operating Temperature: 0oC to 85oC Storage Temperature: -55oC to +100oC