Experience & knowledge of display technology has made Hanns G a leader in the global monitor market. Each Hanns G monitor is carefully crafted to deliver a perfect harmony of design, performance & practicality, & the comprehensive portfolio enables you to select the right monitor, no matter how specific your requirements may be. Designed to ensure personal comfort the ergonomic HP205DJB offers sophisticated practicality with tilt, swivel & height adjust functionality as standard. With LEDtechnology allowing for a sleek, thin design this monitor is also all mountable, as well as energy efficient to help keep energy bills down. Additional features of this complete AV solution include: built-in speakers; 80 Mio:1 Active Contrast delivering spectacular visuals; & Multi-Video Modes to suit specific application requirements. Technical

Specification Display

Size: 19.5” Resolution: 1600 x 900 Aspect Ratio: 16:9 Brightness: 250cd/m 2 Typical Contrast ratio: 1000:1 Active Contrast Ratio: 80, 000, 000:1 Response time: 5ms Colour

Depth: 16.7M Viewing Angle: 170°/160° Pixel Pitch: 0.27 x 0.27 LED Backlight Panel Surface: Anti-Glare Connectivity VGA x 1 DVI-D x 1 PC Audio x 1 Features Speaker: 1W x 2 Tilt: 5+/-2~15+/-2 Height Adjustable: 110mm Swivel: Left 30&8728;, Right 30&8728; VESA 100 x 100 Kensington Lock Power Power Supply: AC 100~240V, 50~60 Hz Power consumption standby mode: <0.5W

Dimensions (Wx Hx D) 457.3 x 340.7 x 169.3mm







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HP 125A Laser Jet Toner Cartridge Dual Packs let you print more & save more. Get professional print quality for a better value ...

Attack the competition with Hyper X Savage memory. Its unique, asymmetrical red heat spreader is made from high-quality aluminum & has a black PCB & a diamond cut finish to make your game shine & help you stand out in the crowd. The heat spreader dissipates heat so your system stays cool & reliable & its low profile fits under oversized CPU coolers. Featuring a design that works well with the latest trends in gaming, Hyper X Savage comes in a wide range of high-performance speeds, from 1600 M Hz to 2400 M Hz, & capacities from 4GB to 8GB in single modules & 8GB to 32GB kits. In CL9-CL11 latencies, it delivers ultra-responsive multitasking & an overall faster system. Dual & quad channel kits are available. Built-in, h&-tuned XMP profiles let users reach higher-performing frequencies, timings & voltages simply by enabling Intel's XMP tool. Even noobs can overclock their platforms with no need for manual adjustments in BIOS. Hyper X Savage is backed by a lifetime warranty & free technical support. ...

Hyper X Impact memory boasts the world's fastest SO-DIMM frequency- 2666 M Hz
- to keep you ahead of the curve & level up your
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Get in the game with Hyper X FURY. Even newbies get up to speed fast, since FURY automatically recognises its host platform & automatically overclocks to up to 1866 M Hz, providing plenty of power for your next death match. FURY's asymmetric heatspreader design lets you stand out from the crowd. It's available in black, blue, red & -- for the first time in the Hyper X line -- white, with a black PCB. So your rig can reflect your style & you can show it off with pride. It's 100-percent tested & LAN-ready plus it's backed by free technical support. Hyper X Pn P memory will run in most DDR3 systems up to the speed allowed by the manufacturer's system BIOS. Pn P cannot increase the system memory speed faster than is allowed by the manufacturer's BIOS. Hyper X FURY is available in frequency speeds from 1333 M Hz to 1866 M Hz. Reach faster speeds & higher capacities by just installing the memory, no adjustments in BIOS needed. No matter if you are an Intel or AMD gamer, the Hyper X FURY is ideal for you. To make sure it works, Hyper X FURY has been tested with popular brands of motherboards. Does your system have enough memory to get you into the game? Kits are available to max out your system's memory with up to 16GB of high-performance goodness. ...

SPECIFICATIONS CL (IDD) 10 cycles Row Cycle Time (t R Cmin) 48.125ns (min.) Refresh to Active/ Refresh 260ns (min.) Command Time (t RFCmin) Row Active Time (t RASmin) 37.5ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V
- 0 Operating Temperature 0oC to 85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) • 800 M Hz f CK for 1600 Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset • PCB: Height 1.180” (30.00mm), double sided component


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SPECIFICATIONS CL (IDD) 10 cycles Row Cycle Time (t R Cmin) 48.125ns (min.) Refresh to Active/ Refresh 260ns (min.) Command Time (t RFCmin) Row Active Time (t RASmin) 37.5ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V
- 0 Operating Temperature 0oC to 85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) • 800 M Hz f CK for 1600 Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset • PCB: Height 1.180” (30.00mm), double sided component


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Get in the game with Hyper X FURY. Even newbies get up to speed fast, since FURY automatically recognises its host platform & automatically overclocks to up to 1866 M Hz, providing plenty of power for your next death match. FURY's asymmetric heatspreader design lets you stand out from the crowd. It's available in black, blue, red & -- for the first time in the Hyper X line -- white, with a black PCB. So your rig can reflect your style & you can show it off with pride. It's 100-percent tested & LAN-ready plus it's backed by free technical support. Hyper X Pn P memory will run in most DDR3 systems up to the speed allowed by the manufacturer's system BIOS. Pn P cannot increase the system memory speed faster than is allowed by the manufacturer's BIOS. Hyper X FURY is available in frequency speeds from 1333 M Hz to 1866 M Hz. Reach faster speeds & higher capacities by just installing the memory, no adjustments in BIOS needed. No matter if you are an Intel or AMD gamer, the Hyper X FURY is ideal for you. To make sure it works, Hyper X FURY has been tested with popular brands of motherboards. Does your system have enough memory to get you into the game? Kits are available to max out your system's memory with up to 16GB of high-performance goodness. ...

SPECIFICATIONS CL (IDD) 10 cycles Row Cycle Time (t R Cmin) 48.125ns (min.) Refresh to Active/ Refresh 260ns (min.) Command Time (t RFCmin) Row Active Time (t RASmin) 37.5ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V
- 0 Operating Temperature 0oC to 85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) • 800 M Hz f CK for 1600 Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset • PCB: Height 1.180” (30.00mm), double sided component


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SPECIFICATIONS CL (IDD) 10 cycles Row Cycle Time (t R Cmin) 44.75ns (min.) Refresh to Active/ Refresh 260ns (min.) Command Time (t RFCmin) Row Active Time (t RASmin) 32.125ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V
- 0 Operating Temperature 0oC to 85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) • 933 M Hz f CK for 1866 Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset • PCB: Height 1.180” (30.00mm), double sided component


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