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ASUS PRIME Z690M-PLUS D4 MATX Motherboard
Features • Intel LGA 1700 socket: Ready for 12th gen Intel processors • Enhanced power solution: 10+1 DrMOS, 4-pin+8-pin ProCool connector, alloy chokes and durable capacitors for stable power delivery • Comprehensive cooling: Large VRM heatsinks, PCH heatsink, hybrid fan headers and Fan Xpert 4 • ASUS OptiMem II: Careful routing of traces and vias, plus ground layer optimizations to preserve signal integrity for improved memory overclocking • Next-gen connectivity: DDR4, PCIe 5.0, Intel 1 Gb Ethernet, USB 3.2 Gen 2x2 Type-C, front panel USB 3.2 Gen 1 Type-C, Thunderbolt™ 4 header UEFI BIOS The renowned ASUS UEFI BIOS provides everything you need to configure, tweak and tune your system. It offers intelligently simplified options for PC DIY
beginners, as well as comprehensive features for seasoned veterans. VRM Heatsinks and High-quality Thermal Pads Two massive VRM heatsinks and high-quality thermal pads improve heat transfer from the MOSFETs and chokes for better cooling performance PERFORMANCE Prime Z690 series is built to handle the additional cores and increased bandwidth of 12th Generation Intel processors. ASUS Z690 motherboards provide all the fundamentals to boost daily productivity, so your system will be ready for action with stable power, intuitive cooling and flexible transfer options. Power Design Stable power is essential to extract every last bit of performance out of 12th Generation Intel processors. Prime Z690M-Plus D4 is geared to cater to the demands of these high-core-count CPUs. ASUS OptiMem II
Revisions to the motherboard’s trace routing provide the latest Intel processors with unrestricted access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce vias and adds shielding zones that significantly reduce crosstalk. Benefits of ASUS OptiMem II: • Improved memory stability and compatibility • Allows lower memory latencies at equivalent voltages • Improved memory frequency margin Motherboards with OptiMem II technology were tested with Synopsys HSPICE simulation software Top layer – ground ring to prevent lateral interference DDR4 5333 (OC) Improvements to trace routing design provide the latest Intel processors with enhanced access to memory bandwidth. ASUS OptiMem II technology
carefully maps memory signal pathways across different PCB layers to reduce path distance, and it adds shielding zones that significantly reduce crosstalk.
beginners, as well as comprehensive features for seasoned veterans. VRM Heatsinks and High-quality Thermal Pads Two massive VRM heatsinks and high-quality thermal pads improve heat transfer from the MOSFETs and chokes for better cooling performance PERFORMANCE Prime Z690 series is built to handle the additional cores and increased bandwidth of 12th Generation Intel processors. ASUS Z690 motherboards provide all the fundamentals to boost daily productivity, so your system will be ready for action with stable power, intuitive cooling and flexible transfer options. Power Design Stable power is essential to extract every last bit of performance out of 12th Generation Intel processors. Prime Z690M-Plus D4 is geared to cater to the demands of these high-core-count CPUs. ASUS OptiMem II
Revisions to the motherboard’s trace routing provide the latest Intel processors with unrestricted access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce vias and adds shielding zones that significantly reduce crosstalk. Benefits of ASUS OptiMem II: • Improved memory stability and compatibility • Allows lower memory latencies at equivalent voltages • Improved memory frequency margin Motherboards with OptiMem II technology were tested with Synopsys HSPICE simulation software Top layer – ground ring to prevent lateral interference DDR4 5333 (OC) Improvements to trace routing design provide the latest Intel processors with enhanced access to memory bandwidth. ASUS OptiMem II technology
carefully maps memory signal pathways across different PCB layers to reduce path distance, and it adds shielding zones that significantly reduce crosstalk.
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