Features • NVIDIA Ampere Streaming Multiprocessors: The building blocks for the world’s fastest, most efficient GPUs, the all-new Ampere SM brings 2X the FP32 throughput & enhanced power efficiency. • 2nd Generation RT Cores: Experience 2X the throughput of 1st gen RT Cores, plus concurrent RT & shading for a whole new level of ray tracing performance. • 3rd Generation Tensor Cores: Get up to 2X the throughput with structural sparsity & advanced AI algorithms such as DLSS. These cores deliver a massive boost in game performance & all-new AI capabilities. • This Ge Force RTX 3060 Ti graphics card with LHR (lite hash rate) delivers 25 MH/s ETH hash rate (est.). • OC Edition: Boost clock 1785 MHz (OC mode)/ 1755 MHz (Gaming mode). • Axial-tech fan design has been newly tuned with a reversed central fan direction for less turbulence. • Dual ball fan bearings can last up to twice as long as sleeve bearing designs. • Military-grade capacitors & other TUF components enhance durability & performance. • GPU Tweak II provides intuitive performance tweaking, thermal controls, & system monitoring. Built TUF The TUF GAMING Ge Force RTX™ 3060 Ti has been stripped down & built back up to provide more robust power & cooling. A new all-metal shroud houses three powerful axial-tech fans that utilize durable dual ball fan bearings. Fan rotation has been optimized for reduced turbulence, & a stop mode brings all three fans to a halt at low temps. Beneath, a thick heatsink keeps thermals under tight control. Additional features, including TUF components, Auto-Extreme Technology, & a backplate vent make the TUF a proper powerhouse. For builders looking for a new “old faithful”, this card has your back. Axial-tech Upgrades TUF Gaming cards leverage our tried-&-true Axial-tech fan design, with three fans working in tandem to satisfy the thermal demands of NVIDIA’s new high-octane design. The fans rely on dual ball fan bearings to ensure consistent performance & increased longevity compared to sleeve bearings & other bearing types. Max Contact To get heat up off the die & into the heatsink array, we’ve engaged Max Contact technology to polish the surface of the heat spreader & improve smoothness at the microscopic level. The extra flatness allows for better contact with the die for enhanced thermal transfer. 2.7-slot Design The heat spreader draws heat up into heatpipes that carry it through a fin stack that fills most of the card’s large, 2.7-slot footprint.