Crucial Ballistix
- DDR3
- 8 GB
- DIMM 240-pin
- 1866 MHz / PC3-14900
- 1.5 V
- unbuffered
- non-ECC Put your






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Get ready to play. Engineered to deliver fast & reliable performance memory for enthusiasts & mainstream users alike, the Crucial Ballistix Sport series is a great place to start. Touting all the usual benefits of a memory upgrade — faster load times, better system responsiveness, & increased ability to handle data-intensive games — Ballistix Sport modules also feature an array of additional features. With an eye-catching design, premium-quality DRAM, & a stylish integrated heat spreader for thermal performance, Ballistix Sport makes it easy to take your game to the next level. Since Ballistix Sport performance memory is budget-friendly & compatible with nearly every type of system, you’ll be hard pressed to find a better win. Get ready to play. Engineered to deliver fast & reliable performance memory for enthusiasts & mainstream users alike, the Crucial Ballistix Sport series is a great place to start. Touting all the usual benefits of a memory upgrade—faster load times, better system responsiveness, & increased ability to handle data-intensive games— Ballistix Sport modules also feature an array of additional features. With an eye�-catching design, premium-quality DRAM, & a stylish integrated heat spreader for thermal performance, Ballistix Sport makes it easy to take your game to the next level. Since Ballistix Sport performance memory is budget-friendly & compatible with nearly every type of system, you’ll be hard pressed to find a better win. Crucial—quality you can depend on. Crucial is a trusted name when it comes to DRAM, & that’s no coincidence. As a brand of Micron, one of the largest manufacturers of DRAM in the world, we work with our engineers to design, refine, test, manufacture, & support our extensive line of memory modules. With a product portfolio that

Includes:: thousands of different DRAM upgrades for more than 50, 000 systems, we’ve got one specifically designed for your computer. For more than fifteen years we’ve kept gamers & system builders happy with premium quality memory & outstanding customer service.

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Low Profile Extreme Performance DDR3 Memory Whether your system is a beast with an oversized CPU cooler or a savvy small-form-factor PC, G.SKILL ARES is built for ultra high performance & rock solid stability. Named after the Greek god of war, G.SKILL ARES will serve & power your system in your daily battles of gaming & computing. Low Profile Heat Spreader Design G.SKILL ARES is the best choice for optimum adaptability/fitment for your system. At only 3.2cm tall, the low profile heat spreader design of G.SKILL ARES is the ideal memory for systems with massive CPU coolers or for small-form-factor PCs, where every millimeter counts. Solid Reliability & Ultra High Performance Like all G.SKILL memory products, each ARES memory kit are put through extensive reliability & compatibility tests with a wide range of Intel & AMD platforms. The stress tests ensure ARES memory kits delivery outstanding performance & durability, while maintaining overclocking headroom. Intel XMP Support All G.SKILL DDR3 memory come with the latest Intel XMP standard developed for Intel platform. It provides PC enthusiasts an entirely trouble free overclocking experience to boost their Intel systems for extreme levels of performance, while retaining system stability. ...

Low Profile Extreme Performance DDR3 Memory Whether your system is a beast with an oversized CPU cooler or a savvy small-form-factor PC, G.SKILL ARES is built for ultra high performance & rock solid stability. Named after the Greek god of war, G.SKILL ARES will serve & power your system in your daily battles of gaming & computing. Low Profile Heat Spreader Design G.SKILL ARES is the best choice for optimum adaptability/fitment for your system. At only 3.2cm tall, the low profile heat spreader design of G.SKILL ARES is the ideal memory for systems with massive CPU coolers or for small-form-factor PCs, where every millimeter counts. Solid Reliability & Ultra High Performance Like all G.SKILL memory products, each ARES memory kit are put through extensive reliability & compatibility tests with a wide range of Intel & AMD platforms. The stress tests ensure ARES memory kits delivery outstanding performance & durability, while maintaining overclocking headroom. Intel XMP Support All G.SKILL DDR3 memory come with the latest Intel XMP standard developed for Intel platform. It provides PC enthusiasts an entirely trouble free overclocking experience to boost their Intel systems for extreme levels of performance, while retaining system stability. ...

ow Profile Extreme Performance DDR3 Memory Whether your system is a beast with an oversized CPU cooler or a savvy small-form-factor PC, G.SKILL ARES is built for ultra high performance & rock solid stability. Named after the Greek god of war, G.SKILL ARES will serve & power your system in your daily battles of gaming & computing. Low Profile Heat Spreader Design G.SKILL ARES is the best choice for optimum adaptability/fitment for your system. At only 3.2cm tall, the low profile heat spreader design of G.SKILL ARES is the ideal memory for systems with massive CPU coolers or for small-form-factor PCs, where every millimeter counts. Solid Reliability & Ultra High Performance Like all G.SKILL memory products, each ARES memory kit are put through extensive reliability & compatibility tests with a wide range of Intel & AMD platforms. The stress tests ensure ARES memory kits delivery outstanding performance & durability, while maintaining overclocking headroom. Intel XMP Support All G.SKILL DDR3 memory come with the latest Intel XMP standard developed for Intel platform. It provides PC enthusiasts an entirely trouble free overclocking experience to boost their Intel systems for extreme levels of performance, while retaining system stability. ...

Attack the competition with Hyper X Savage memory. Its unique, asymmetrical red heat spreader is made from high-quality aluminum & has a black PCB & a diamond cut finish to make your game shine & help you stand out in the crowd. The heat spreader dissipates heat so your system stays cool & reliable & its low profile fits under oversized CPU coolers. Featuring a design that works well with the latest trends in gaming, Hyper X Savage comes in a wide range of high-performance speeds, from 1600 M Hz to 2400 M Hz, & capacities from 4GB to 8GB in single modules & 8GB to 32GB kits. In CL9-CL11 latencies, it delivers ultra-responsive multitasking & an overall faster system. Dual & quad channel kits are available. Built-in, h&-tuned XMP profiles let users reach higher-performing frequencies, timings & voltages simply by enabling Intel's XMP tool. Even noobs can overclock their platforms with no need for manual adjustments in BIOS. Hyper X Savage is backed by a lifetime warranty & free technical support. ...

Attack the competition with Hyper X Savage memory. Its unique, asymmetrical red heat spreader is made from high-quality aluminum & has a black PCB & a diamond cut finish to make your game shine & help you stand out in the crowd. The heat spreader dissipates heat so your system stays cool & reliable & its low profile fits under oversized CPU coolers. Featuring a design that works well with the latest trends in gaming, Hyper X Savage comes in a wide range of high-performance speeds, from 1600 M Hz to 2400 M Hz, & capacities from 4GB to 8GB in single modules & 8GB to 32GB kits. In CL9-CL11 latencies, it delivers ultra-responsive multitasking & an overall faster system. Dual & quad channel kits are available. Built-in, h&-tuned XMP profiles let users reach higher-performing frequencies, timings & voltages simply by enabling Intel's XMP tool. Even noobs can overclock their platforms with no need for manual adjustments in BIOS. Hyper X Savage is backed by a lifetime warranty & free technical support. ...

Hyper X Impact memory boasts the world's fastest SO-DIMM frequency- 2666 M Hz
- to keep you ahead of the curve & level up your
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SPECIFICATIONS CL (IDD) 10 cycles Row Cycle Time (t R Cmin) 44.75ns (min.) Refresh to Active/ Refresh 260ns (min.) Command Time (t RFCmin) Row Active Time (t RASmin) 32.125ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V
- 0 Operating Temperature 0oC to 85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) • 933 M Hz f CK for 1866 Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset • PCB: Height 1.180” (30.00mm), single sided component


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SPECIFICATIONS CL (IDD) 10 cycles Row Cycle Time (t R Cmin) 44.75ns (min.) Refresh to Active/ Refresh 260ns (min.) Command Time (t RFCmin) Row Active Time (t RASmin) 32.125ns (min.) Maximum Operating Power TBD W* UL Rating 94 V
- 0 Operating Temperature 0oC to 85oC Storage Temperature -55oC to +100oC * Power will vary depending on the SDRAM used. FEATURES • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) • 933 M Hz f CK for 1866 Mb/sec/pin • 8 independent internal bank • Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset • PCB: Height 1.180” (30.00mm), double sided component


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