Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed & high-temperature stability. These compounds resist changes in consistency at temperatures up to 177ï¿12;C (350ï¿12;F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.