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Kingston's KHX1600C9D3K4/16GX is a kit of four 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2 Rx 8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 16GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers & requires +1.5V. Key Features 16GB (4x 4GB) DDR3 for AMD, Intel Dual processors & new 2nd Generation Intel Core platforms 1600 M Hz 9-9-9-27 latency Intel XMP (Extreme Memory Profile) Support ...
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32GB (8x4GB) DDR3 1600MHzHyperX Genesis XMP Memory Kit CL9 1.65V

Kingston's KHX1600C9D3K8/32GX is a kit of eight 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. Features JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 667MHz fCK for 1333Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 9, 8, 7, 6 Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable
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Availability: In Stock
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Product Description

Kingston's KHX1600C9D3K8/32GX is a kit of eight 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2 Rx 8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers & requires +1.5V. Features JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 667 M Hz f CK for 1333 Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 9, 8, 7, 6 Posted CAS Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock Programmable CAS Write Latency (CWL) = 7 (DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C Asynchronous Reset PCB: Height 1.180” (30.00mm), double sided component

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Jargon Buster

PCB - Printed Circuit Board
OHM - A measure of resistance named after George Simon Ohm
DIMM - Dual In-Line Memory Module
Gold - A precious highly conductive metal
4GB - 4 Gigabytes
Clock - A device used for telling the time
Intel - World leaders in silicon chip development and manufacture. Chips for Laptops, desktops and mobile devices. Their main competitor is AMD (Advanced Micro Devices)
8-bit - 8 integers or data units. An 8-bit processor can acess 8-bits in a single operation.
Components - Multiple items used to complete the product.
Gold - A colour, a type of rich metal. Chemical symbol AU.
Memory - A way to describe the way in which the brain can remember things.

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