Kingstons KHX1866C11S3P1K2/4G is a kit of two 256M x 64- bit (2GB) DDR3-1866 CL11 SDRAM (Synchronous DRAM) 1 Rx 8 memory modules, based on eight 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 4GB. Each module kit has been tested to run at JEDEC DDR3-1866 at a low latency timing of 11-11-11 at 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section. Each 204-pin SODIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 933 M Hz f CK for 1866 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 9 (DDR3-1866)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component

















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Kingston's KHX1866C11S3P1K2/4G is a kit of two 256M x 64- bit (2GB) DDR3-1866 CL11 SDRAM (Synchronous DRAM) 1 Rx 8 memory modules, based on eight 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 4GB. Each module kit has been tested to run at JEDEC DDR3-1866 at a low latency timing of 11-11-11 at 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section. Each 204-pin SODIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 933 M Hz f CK for 1866 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 9 (DDR3-1866)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component

















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Kingstons KHX1600C9D3P1K2/8G is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at JEDEC DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section. Each 240-pin DIMM uses gold contact fingers & requires +1.5V. Note: Pn P implementation is only possible in configurations that include a BIOS that supports the Pn P function. Your maximum speed will be determined by your BIOS. **FEATURES**
- JEDEC standard 1.5V ± 0.075V Power Supply
- VDDQ = 1.5V ± 0.075V
- 800 M Hz f CK for 1600 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 5, 6, 7, 8, 9, 10, 11
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 8 (DDR3- 1600)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.18" (30.00mm) double sided component
- Ro HS Compliant


















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Kingston's KHX1600C9D3P1K2/8G is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at JEDEC DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section. Each 240-pin DIMM uses gold contact fingers & requires +1.5V. Note: Pn P implementation is only possible in configurations that include a BIOS that supports the Pn P function. Your maximum speed will be determined by your BIOS. **FEATURES**
- JEDEC standard 1.5V ± 0.075V Power Supply
- VDDQ = 1.5V ± 0.075V
- 800 M Hz f CK for 1600 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 5, 6, 7, 8, 9, 10, 11
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 8 (DDR3- 1600)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.18" (30.00mm) double sided component
- Ro HS Compliant


















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Kingstons KHX1600C9S3P1K2/8G is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2 Rx 8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at JEDEC DDR3-1600 at a low latency timing of 9-9-9 at 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section. Each 204-pin SODIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 800 M Hz f CK for 1600 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 8 (DDR3-1600)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component

















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Kingstons KHX1866C11S3P1K2/8G is a kit of two 512M x 64-bit (4GB) DDR3-1866 CL11 SDRAM (Synchronous DRAM) 2 Rx 8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at JEDEC DDR3-1866 at a low latency timing of 11-11-11 at 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section. Each 204-pin SODIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 933 M Hz f CK for 1866 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 9 (DDR3-1866)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component

















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Kingston's KHX1866C11S3P1K2/8G is a kit of two 512M x 64-bit (4GB) DDR3-1866 CL11 SDRAM (Synchronous DRAM) 2 Rx 8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at JEDEC DDR3-1866 at a low latency timing of 11-11-11 at 1.5V. Additional timing parameters are shown in the Pn P Timing Parameters section. Each 204-pin SODIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 933 M Hz f CK for 1866 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 9 (DDR3-1866)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component

















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Engineered & tested to deliver extreme performance, Kingston Hyper X easily endures the most rigorous demands of any creative professional, gamer or PC enthusiast. ** Hyper X Predator DDR4** Prey on the competition with Hyper X® Predator DDR4, offering low CAS latency & the most aggressive timings on high-speed modules for a new generation of performance. Hyper X Predator's Intel XMP profiles are optimised for X99 motherboards for compatibility & easy overclocking. Like you, Predator DDR4 keeps its cool while gaming, for a cooler & quieter PC. Stand out from the crowd & maximise heat dissipation with Predator's signature tall heat sink, now in black. **FEATURES** Speeds of up to 3000 M Hz 1.2 & 1.35 voltages for stable overclocking Intel XMP-ready profiles optimised for Intel X99 series motherboards Exceptional clock & latency timing specifications to enhance overall system performance Heat sink design achieves effective consistency of speed while prolonging the memory lifecycle 100 per cent factory tested ...

Engineered & tested to deliver extreme performance, Kingston Hyper X easily endures the most rigorous demands of any creative professional, gamer or PC enthusiast. ** Hyper X Predator DDR4** Prey on the competition with Hyper X® Predator DDR4, offering low CAS latency & the most aggressive timings on high-speed modules for a new generation of performance. Hyper X Predator's Intel XMP profiles are optimised for X99 motherboards for compatibility & easy overclocking. Like you, Predator DDR4 keeps its cool while gaming, for a cooler & quieter PC. Stand out from the crowd & maximise heat dissipation with Predator's signature tall heat sink, now in black. **FEATURES** Speeds of up to 3000 M Hz 1.2 & 1.35 voltages for stable overclocking Intel XMP-ready profiles optimised for Intel X99 series motherboards Exceptional clock & latency timing specifications to enhance overall system performance Heat sink design achieves effective consistency of speed while prolonging the memory lifecycle 100 per cent factory tested ...

Engineered & tested to deliver extreme performance, Kingston Hyper X easily endures the most rigorous demands of any creative professional, gamer or PC enthusiast. ** Hyper X Predator DDR4** Prey on the competition with Hyper X® Predator DDR4, offering low CAS latency & the most aggressive timings on high-speed modules for a new generation of performance. Hyper X Predator's Intel XMP profiles are optimised for X99 motherboards for compatibility & easy overclocking. Like you, Predator DDR4 keeps its cool while gaming, for a cooler & quieter PC. Stand out from the crowd & maximise heat dissipation with Predator's signature tall heat sink, now in black. **FEATURES** Speeds of up to 3000 M Hz 1.2 & 1.35 voltages for stable overclocking Intel XMP-ready profiles optimised for Intel X99 series motherboards Exceptional clock & latency timing specifications to enhance overall system performance Heat sink design achieves effective consistency of speed while prolonging the memory lifecycle 100 per cent factory tested ...