Be bold & aggressive with Hyper X black. It features a sleek black heat-spreader for greater heat dissipation to optimize reliability. It adds some edge to your rig
- & your game, with faster speeds & higher capacities
- without a hit to your wallet. It's Intel XMP ready, with XMP profiles built into the modules, so higher performing frequencies, timings & voltage are just a click away.

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Be bold & aggressive with Hyper X black. It features a sleek black heat-spreader for greater heat dissipation to optimize reliability. It adds some edge to your rig
- & your game, with faster speeds & higher capacities
- without a hit to your wallet. Its Intel XMP ready, with XMP profiles built into the modules, so higher performing frequencies, timings & voltage are just a click away.

...

Be bold & aggressive with Hyper X black. It features a sleek black heat-spreader for greater heat dissipation to optimize reliability. It adds some edge to your rig
- & your game, with faster speeds & higher capacities
- without a hit to your wallet. It's Intel XMP ready, with XMP profiles built into the modules, so higher performing frequencies, timings & voltage are just a click away.

...

Be bold & aggressive with Hyper X black. It features a sleek black heat-spreader for greater heat dissipation to optimize reliability. It adds some edge to your rig
- & your game, with faster speeds & higher capacities
- without a hit to your wallet. Its Intel XMP ready, with XMP profiles built into the modules, so higher performing frequencies, timings & voltage are just a click away.

...

Kingstons KHX1600C9D3B1K2/8GX is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM), 2 Rx 8 memory modules, based on sixteen 256M x 8-bit FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
- VDDQ = 1.5V (1.425V ~ 1.575V)
- 667 M Hz f CK for 1333 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 9, 8, 7, 6
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 7 (DDR3-1333)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component
















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Kingstons KHX1600C9D3K2/8G is a kit of two 512M x 64-bit (4GB) DDR3-1600 M Hz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. This module kit has been tested to run at DDR3-1600 M Hz at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 M Hz timing of 9-9-9 at 1.5V. This 240-pin DIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V ± 0.075V Power Supply
- VDDQ = 1.5V ± 0.075V
- 667 M Hz f CK for 1333 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 5, 6, 7, 8, 9, 10
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 7 (DDR3-1333)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component

















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Kingston's KHX1600C9D3K2/8G is a kit of two 512M x 64-bit (4GB) DDR3-1600 M Hz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. This module kit has been tested to run at DDR3-1600 M Hz at a low latency timing of 9-9-9-27 at 1.65V. The SPD's are programmed to JEDEC standard latency DDR3-1333 M Hz timing of 9-9-9 at 1.5V. This 240-pin DIMM uses gold contact fingers & requires +1.5V. **FEATURES**
- JEDEC standard 1.5V ± 0.075V Power Supply
- VDDQ = 1.5V ± 0.075V
- 667 M Hz f CK for 1333 Mb/sec/pin
- 8 independent internal bank
- Programmable CAS Latency: 5, 6, 7, 8, 9, 10
- Posted CAS
- Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock
- Programmable CAS Write Latency (CWL) = 7 (DDR3-1333)
- 8-bit pre-fetch
- Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
- Bi-directional Differential Data Strobe
- Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
- On Die Termination using ODT pin
- Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
- Asynchronous Reset
- PCB: Height 1.180" (30.00mm), double sided component

















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Kingstons KHX1600C9D3X2K2/8GX is a kit of two 512 M x 64-bit DDR3-1600 M Hz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 256 M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Each module kit has been tested to run at DDR3-1600 MHz at low latency timing. The SPDs are programmed to JEDEC standard latency DDR3-1333 M Hz timing. ...

Kingston's KHX1600C9D3X2K2/8GX is a kit of two 512 M x 64-bit DDR3-1600 M Hz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 256 M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Each module kit has been tested to run at DDR3-1600 MHz at low latency timing. The SPDs are programmed to JEDEC standard latency DDR3-1333 M Hz timing. ...

Get in the game with Hyper X FURY. Even newbies get up to speed fast, since FURY automatically recognises its host platform & automatically overclocks to the highest frequency published
- up to 1866 M Hz
- providing plenty of power for your next deathmatch. Affordably priced, FURYs asymmetric heat spreader design is available in black, blue, red &- for the first time in the Hyper X line -white, with a black PCB. Its 100 per cent tested & backed by a lifetime warranty & free technical support.
- Asymmetric heat spreader for stylish heat dissipation
- Compatible with Intel & AMD platforms ** Features & Benefits**
- Unique -- tested with all popular brands of motherboards
- Easy to install -- Plug-&-Play functionality
- Automatic overclocking -- reach faster speeds & higher capacities just by installing the memory, no adjustments in BIOS needed
- Reliable -- 100 per cent factory tested
- Lifetime warranty, free technical support ** Specifications**
- Capacity 8GB
- Frequency speed 1333 M Hz
- CAS latency 9-9-9-27
- Voltage 1.5V
- Operating temperature 0C to 85C
- Storage temperature -55C to 100C
-

Dimensions 133.35mm x 32.8mm
- Compatible with P55, H67, P67, Z68, Z77, Z87 & H61 Intel chipsets, as well as A75, A87, A88, A89, A78 & E35 AMD chipsets


















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