The much anticipated HAF X arrives as the flagship of the popular HAF (High Air Flow) series. Designed for performance systems, this chassis is able to house today's latest & hottest CPUs, motherboards, graphics cards & is even compatible with USB (Universal Serial Bus) 3.0 devices. With specialized support & cooling for graphic cards, massive airflow with the help of up to four gigantic fans & easy access to installed components, this as close as it gets to a system builder's 'dream case'.
- SATA Dock for easy installation without the need of removing side panel
- Internal USB (Universal Serial Bus) 3.0 on front I/O panel
- Air duct to cool the latest graphic cards
- Up to 1 x 230 mm red LED fan & 3 x 200 mm fans
- 9 slots support triple VGA cards
- Adjustable VGA card holder to support heavier GPU cards
- Power supply partition to conceal cables
- Advanced cable management with rubber grommets
- Spacious interior for larger component parts
- Rugged black coated interior









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Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed & high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. ...

Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed & high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. ...

Cooler Master HTK-002-U1 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed & high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. ...

The Hyper 103 is an affordable mainstream heatsink that delivers great cooling performance. Air flow is optimized towards heatpipes thanks to a special fin design & exclusive X-Vent & Air-Guide technology. A 92 mm PWM fan has a wide speed range. This low profile tower heatsink is a great match for all modern small form factor systems. ...

The Hyper 103 is an affordable mainstream heatsink that delivers great cooling performance. Air flow is optimized towards heatpipes thanks to a special fin design & exclusive X-Vent & Air-Guide technology. A 92 mm PWM fan has a wide speed range. This low profile tower heatsink is a great match for all modern small form factor systems. ...

The Hyper 212 EVO cooling systems are designed & optimized to provide the best user experience & cooling potential for a new generation of processors. The Hyper 212 EVO now features four Cooler Master patented Continuous Direct Contact (CDC) heat pipes that are tightly packed into a flat array on the CPU Cooler base. This acts as a virtual vapor chamber that dissipates a large amount of heat. The aluminum fin structure has been optimized to provide the perfect performance balance between high & low speed fan operations ...

The Hyper 212 EVO cooling systems are designed & optimized to provide the best user experience & cooling potential for a new generation of processors. The Hyper 212 EVO now features four Cooler Master patented Continuous Direct Contact (CDC) heat pipes that are tightly packed into a flat array on the CPU Cooler base. This acts as a virtual vapor chamber that dissipates a large amount of heat. The aluminum fin structure has been optimized to provide the perfect performance balance between high & low speed fan operations ...

The Hyper 212 EVO cooling systems are designed & optimized to provide the best user experience & cooling potential for a new generation of processors. The Hyper 212 EVO now features four Cooler Master patented Continuous Direct Contact (CDC) heat pipes that are tightly packed into a flat array on the CPU Cooler base. This acts as a virtual vapor chamber that dissipates a large amount of heat. The aluminum fin structure has been optimized to provide the perfect performance balance between high & low speed fan operations ...

The Hyper 212X features a PWM-controlled fan & provides incredibly low noise level. Amazing CDC & X-Vent technologies, funnel-shaped aluminum fins & a series of perforated dimples create a CPU cooler that is optimized for great heat dissipation. The universal bracket design ensures easy & worry-free installation on every platform. ...