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Asus P8H61-MX/USB3 S1155 Intel H61 DDR3 MATX
**P8H61-MX USB3: Cost attractive model for H61 uATX motherboard with USB 3.0** - USB 3.0 - The latest data transfer technology. - PCIe 3.0 - Improve your graphic performance with incredible data speed. - GPU BOOST - Go to the Limit with iGPU Level Up! - UEFI BIOS (EZ Mode) - Flexible & Easy BIOS Interface - Anti Surge - Full-time Power Guardian-Make System Free From Risk **LGA1155 socket for Intel Third Generation Processors** This motherboard supports the latest Intel Ivy Bridge processors in the LGA1155 package, with memory and PCI Express controllers integrated to support 2-channel DDR3 memory and 16 PCI Express 3.0 lanes. This provides great graphics performance. Intel Ivy Bridge processors are among the most powerful and energy efficient CPUs in the world. **H61** The Intel
H61(B3) Express Chipset is the latest single-chipset design to support the new 1155 socket Intel 3rd/2nd generation processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. **PCIe 3.0** The latest PCI Express bus standard delivers improved encoding for twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. **Dual-Channel DDR3 2200(O.C.)/2133(O.C.)/2000(O.C.)/1866(O.C.)/1600/1333/1066 support** The motherboard supports DDR3 memory that
features data transfer rates of 2200(O.C.)/2133(O.C.)/2000(O.C.)/1866(O.C.)/1600/1333/1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance. **GPU Boost** GPU Boost overclocks the integrated GPU in rea
H61(B3) Express Chipset is the latest single-chipset design to support the new 1155 socket Intel 3rd/2nd generation processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. **PCIe 3.0** The latest PCI Express bus standard delivers improved encoding for twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. **Dual-Channel DDR3 2200(O.C.)/2133(O.C.)/2000(O.C.)/1866(O.C.)/1600/1333/1066 support** The motherboard supports DDR3 memory that
features data transfer rates of 2200(O.C.)/2133(O.C.)/2000(O.C.)/1866(O.C.)/1600/1333/1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance. **GPU Boost** GPU Boost overclocks the integrated GPU in rea
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