Test methods for electrical materials, printed boards & other interconnection structures & assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Accuracy, Precision, Reports, Visual inspection (testing), Dimensional measurement, Fire tests, Mechanical testing, Peeling tests, Electrical testing, Environmental testing, Thermal testing, Solderability testing ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. General test methods & methodology Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Accuracy, Precision, Approval testing, Visual inspection (testing), Specimen preparation, Chemical analysis & testing, Mechanical testing, Electrical testing, Environmental testing, Statistical methods of analysis ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. Test methods for materials for interconnection structures. Relative permittivity & loss tangent (500 MHz to 10 GHz) Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Testing conditions, Chemical analysis & testing, Accuracy, Precision, Chemical-resistance tests, Sodium hydroxide, Test specimens, Impregnated materials, Gelation, Time, Plastics, Determination of content, Compressible flow, Flow measurement, Electrical testing, Electrical resistivity, Resistance measurement, Electric arcs, Test equipment, Volatile matter determination, Thermal testing, Thermal-shock tests, Blistering, Pull-out tests, Peeling tests, High-temperature testing, Cleaning, Position, Electrodes ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity & loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Testing conditions, Chemical analysis & testing, Accuracy, Precision, Chemical-resistance tests, Sodium hydroxide, Test specimens, Impregnated materials, Gelation, Time, Plastics, Determination of content, Compressible flow, Flow measurement, Electrical testing, Electrical resistivity, Resistance measurement, Electric arcs, Test equipment, Volatile matter determination, Thermal testing, Thermal-shock tests, Blistering, Pull-out tests, Peeling tests, High-temperature testing, Cleaning, Position, Electrodes ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. Test methods for materials for interconnection structures Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Testing conditions, Chemical analysis & testing, Accuracy, Precision, Chemical-resistance tests, Sodium hydroxide, Test specimens, Impregnated materials, Gelation, Time, Plastics, Determination of content, Compressible flow, Flow measurement, Electrical testing, Electrical resistivity, Resistance measurement, Electric arcs, Test equipment, Volatile matter determination, Thermal testing, Thermal-shock tests, Blistering, Pull-out tests, Peeling tests, High-temperature testing, Cleaning, Position, Electrodes ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. Test methods for interconnection structures (printed boards) Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Accuracy, Precision, Reports, Visual inspection (testing), Dimensional measurement, Fire tests, Mechanical testing, Peeling tests, Electrical testing, Environmental testing, Thermal testing, Solderability testing ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. General test methods for materials & assemblies. Guidance for printed board assemblies Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis & testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials) ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. General test methods for materials & assemblies. Soldering flux for printed board assemblies Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis & testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials) ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. General test methods for materials & assemblies. Soldering paste for printed board assemblies Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis & testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials) ...

Test methods for electrical materials, printed boards & other interconnection structures & assemblies. General test methods for materials & assemblies. Solder alloys & fluxed & non-fluxed solid wire for printed board assemblies Printed circuits, Printed-circuit boards, Electronic equipment & components, Electrical insulating materials, Visual inspection (testing), Dimensional measurement, Chemical analysis & testing, Mechanical testing, Electrical testing, Environmental testing, Soldering, Fluxes (materials) ...