Kingston's KHX1600C9D3K8/32GX is a kit of eight 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2 Rx 8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 32GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers & requires +1.5V. Features JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply VDDQ = 1.5V (1.425V ~ 1.575V) 667 M Hz f CK for 1333 Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 9, 8, 7, 6 Posted CAS Programmable Additive Latency: 0, CL
- 2, or CL
- 1 clock Programmable CAS Write Latency (CWL) = 7 (DDR3-1333) 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with t CCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Bi-directional Differential Data Strobe Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C Asynchronous Reset PCB: Height 1.180” (30.00mm), double sided component